A3P1000-PQG208

The A3P1000-PQG208 is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology. It combines a substantial logic fabric with on-chip embedded memory and a high I/O count in a surface-mount 208-BFQFP package.

With 24,576 logic elements (approximately 1,000,000 gates), 147,456 bits of embedded RAM (approximately 0.15 Mbits), and 154 I/O pins, this commercial-grade FPGA is suited to designs that require reprogrammable logic capacity, moderate embedded memory, and a dense I/O footprint within a 28 × 28 mm PQFP package. The device operates from a 1.425 V to 1.575 V supply and is rated for 0 °C to 85 °C operation.

Key Features

• Core ProASIC3 field programmable gate array architecture provided by Microchip Technology for reconfigurable logic implementation.
• Logic Capacity 24,576 logic elements, delivering approximately 1,000,000 gates for mid-range logic integration and complex control functions.
• Embedded Memory 147,456 bits of on-chip RAM (approximately 0.15 Mbits) for data buffering, small FIFOs, and temporary storage within designs.
• High I/O Count 154 general-purpose I/O pins to support multiple peripherals, parallel interfaces, and dense system interconnects.
• Package and Mounting 208-BFQFP (supplier package: 208-PQFP, 28×28 mm) surface-mount package for compact PCB implementation.
• Supply and Temperature Single supply range of 1.425 V to 1.575 V and commercial operating temperature range of 0 °C to 85 °C.
• Environmental RoHS compliant for environmentally conscious designs.

Typical Applications

• Embedded control and glue logic Use the device’s 24,576 logic elements to implement custom state machines, control paths, and system glue logic in compact boards.
• I/O aggregation and protocol bridging The 154 I/O pins enable aggregation of multiple peripheral interfaces or bridging between different subsystems.
• On-board data buffering and small memory tasks Approximately 0.15 Mbits of embedded RAM supports buffering, small FIFOs, and temporary data storage within FPGA logic.
• Prototyping and reconfigurable integration The ProASIC3 FPGA form factor and logic capacity support iterative development and design refinement without changing ASIC hardware.

Unique Advantages

• Balanced logic and memory capacity: 24,576 logic elements and 147,456 bits of RAM provide a combination of resources for both combinational and storage needs.
• High pin count in a compact package: 154 I/Os in a 208-BFQFP (28×28 mm) surface-mount package enable dense system integration on space-constrained PCBs.
• Predictable supply requirements: A defined supply range of 1.425 V to 1.575 V supports straightforward power-supply planning.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation for general-purpose, commercial applications.
• RoHS compliance: Environmentally compliant manufacturing materials reduce end-of-life environmental impact.
• Trusted manufacturer: Manufactured by Microchip Technology, providing access to product documentation and support resources.

Why Choose A3P1000-PQG208?

The A3P1000-PQG208 positions itself as a commercially rated, mid-range FPGA option that balances logic density, embedded RAM, and a high I/O count in a compact 208-BFQFP surface-mount package. It is suitable for designers who need reprogrammable logic capacity and a dense I/O interface while operating within standard commercial temperature and supply conditions.

Choose this part when your design requires a combination of roughly 24,576 logic elements, around 0.15 Mbits of on-chip memory, and 154 I/Os under a single, RoHS-compliant package from Microchip Technology, enabling scalable prototypes and production designs with reconfigurable logic.

Request a quote or submit an inquiry for pricing and availability of A3P1000-PQG208 to begin integrating this ProASIC3 FPGA into your next design.