A3P125-TQ144I

The A3P125-TQ144I is a ProASIC3 Field Programmable Gate Array from Microchip Technology designed for embedded logic implementations requiring moderate density and robust environmental operation. It provides a combination of 125,000 gates, 3,072 logic elements and 36,864 bits of on-chip RAM in a surface-mount 144-LQFP package.

With 100 general-purpose I/Os, an industrial temperature grade of −40 °C to 100 °C and a tightly specified core supply range of 1.425 V to 1.575 V, this device targets designs that need reliable digital integration, compact packaging and predictable power requirements.

Key Features

• Core Logic 125,000 gates and 3,072 logic elements provide the programmable resources for implementing custom digital functions and medium-complexity state machines.
• Embedded Memory 36,864 bits of on-chip RAM support data buffering, small FIFOs and local storage for logic-intensive applications.
• I/O Count 100 user I/Os enable wide peripheral interfacing and flexible signal routing for control and data paths.
• Power Specified core supply voltage of 1.425 V to 1.575 V supports precise power sequencing and predictable device behavior.
• Package and Mounting Surface-mount 144-LQFP package (supplier device package: 144-TQFP 20×20) provides a compact, board-friendly footprint.
• Temperature and Grade Industrial grade operation over −40 °C to 100 °C for deployment in harsh or temperature-variable environments.
• Environmental Compliance RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Industrial Control — Leverages the industrial temperature range and 100 I/Os for machine control, PLC interfaces and I/O aggregation in factory environments.
• Embedded Logic and Glue — Uses 125,000 gates and 3,072 logic elements to implement custom glue logic, protocol translators and mid-range control functions within embedded systems.
• Data Buffering and Small Memory Tasks — Employs 36,864 bits of on-chip RAM for buffering, small FIFOs and temporary data storage in real-time pipelines.

Unique Advantages

• Balanced Logic Density: 125,000 gates and 3,072 logic elements provide a middle-ground capacity suitable for many custom digital designs without excessive board-level complexity.
• Generous I/O Count: 100 user I/Os enable flexible interfacing to peripherals, sensors and external devices, reducing the need for additional I/O expanders.
• Industrial-Grade Operation: Rated from −40 °C to 100 °C for deployment in temperature-challenging environments where consistent operation is required.
• Compact Surface-Mount Package: 144-LQFP (144-TQFP 20×20) delivers a compact footprint for space-constrained PCBs while retaining accessible lead pitch for assembly.
• Predictable Power Requirements: Narrow core voltage window (1.425 V–1.575 V) simplifies power-supply selection and ensures stable core operation.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing and end-product requirements.

Why Choose A3P125-TQ144I?

The A3P125-TQ144I positions itself as a reliable, mid-density FPGA solution for designers who need a combination of programmable logic, embedded RAM and substantial I/O in a compact, industrial-grade package. Its defined voltage supply and RoHS compliance make it well suited to production designs that require predictable electrical characteristics and environmental compliance.

Ideal for system engineers and procurement teams focused on embedded control, I/O consolidation and mid-complexity custom logic, the A3P125-TQ144I delivers a balance of integration, thermal tolerance and packaging that supports long-term deployment and maintainable BOM decisions.

Request a quote or submit an inquiry to obtain pricing, lead times and availability for the A3P125-TQ144I.