A3P125-PQG208I

The A3P125-PQG208I is a ProASIC3 family FPGA from Microchip Technology offering reconfigurable logic in a 208-pin BFQFP package. It provides 3,072 logic elements, approximately 36,864 bits of embedded RAM, and 133 user I/O pins for designs that require moderate gate density and on-chip memory in an industrial-temperature FPGA.

Designed for surface-mount applications, this device supports a single supply voltage range of 1.425 V to 1.575 V and operates across an industrial temperature range of −40 °C to 100 °C.

Key Features

• Core Logic 3,072 logic elements (cells) delivering approximately 125,000 gates of reconfigurable logic for implementing custom digital functions.
• Embedded Memory Approximately 36,864 bits of on-chip RAM to support buffering, small FIFOs, and tightly coupled data storage within the FPGA fabric.
• I/O Capacity 133 user I/O pins to connect with external peripherals, sensors, and interfaces while keeping footprint and board routing considerations predictable.
• Package and Mounting 208-BFQFP package (supplier device package listed as 208-PQFP (28x28)) in a surface-mount form factor suitable for compact PCB implementations.
• Power Single supply voltage range from 1.425 V to 1.575 V to match systems designed for that core supply domain.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C for deployment in environments that require extended temperature performance.
• Regulatory Compliance RoHS compliant construction for environmentally conscious designs and manufacturing.

Typical Applications

• Custom digital logic and prototyping — Implement control logic and custom state machines up to ~125,000 gates using 3,072 logic elements and on-chip RAM for intermediate storage.
• Edge I/O aggregation — Aggregate and route signals across 133 user I/Os for medium-density sensor and interface connectivity on a single FPGA.
• Embedded system glue logic — Replace or consolidate discrete glue logic functions with reconfigurable logic while maintaining a compact surface-mount footprint.

Unique Advantages

• Balanced logic and memory — 3,072 logic elements coupled with approximately 36,864 bits of embedded RAM provide a practical balance for control-oriented and data buffering tasks.
• High I/O count — 133 I/Os enable integration of multiple peripherals or interfaces without immediate need for external I/O expanders.
• Industrial temperature rating — Specified operation from −40 °C to 100 °C supports deployment in environments with wide temperature variation.
• Compact surface-mount package — 208-BFQFP (208-PQFP, 28×28) simplifies PCB layout and supports relatively dense boards while keeping a standardized footprint.
• Precise core supply specification — Defined supply range (1.425 V to 1.575 V) helps ensure predictable power budgeting and integration with system regulators.
• RoHS compliant — Meets common lead-free and environmental directives for contemporary manufacturing requirements.

Why Choose A3P125-PQG208I?

The A3P125-PQG208I delivers a practical combination of logic density, embedded memory, and I/O capacity in a surface-mount 208-pin package, making it well suited for engineering projects that require reconfigurable logic with industrial temperature capability. Its defined supply range and RoHS compliance make it straightforward to integrate into regulated production environments.

Backed by Microchip Technology and specified with clear electrical and environmental parameters, this device is appropriate for development teams and production designs that need a mid-density FPGA with on-chip memory and a compact package footprint.

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