A3P125-FGG144T

The A3P125-FGG144T is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology designed for embedded and automotive applications. It provides 3,072 logic elements, approximately 0.037 Mbits (36,864 bits) of on-chip RAM and 97 user I/O pins in a compact 144-LBGA package, enabling medium-complexity digital integration in space-constrained designs.

Qualified to AEC-Q100 and specified for operation from -40°C to 125°C, this device targets applications that require automotive-grade reliability, integrated logic and memory resources, and a controlled voltage supply range of 1.425–1.575 V.

Key Features

• Core Logic 3,072 logic elements (cells) and approximately 125,000 equivalent gates provide the capacity for medium-complexity digital functions and custom logic implementation.
• Embedded Memory 36,864 bits of on-chip RAM (approximately 0.037 Mbits) for block storage, buffering and state retention within the FPGA fabric.
• I/O and Connectivity 97 user I/O pins allow flexible interfacing with external sensors, peripherals and communication devices.
• Power Single core supply specified between 1.425 V and 1.575 V, helping ensure predictable power distribution for the FPGA core.
• Package and Mounting 144-ball LBGA package (supplier package listed as 144-FPBGA, 13×13) with surface-mount mounting suited for compact PCB implementations.
• Automotive Qualification & Temperature Range AEC-Q100 qualification and operating range from -40°C to 125°C support deployment in automotive and other temperature-demanding environments.
• Regulatory Compliance RoHS-compliant construction aligns with environmental and manufacturing requirements.

Typical Applications

• Automotive control modules — Implements custom logic, signal conditioning and I/O aggregation where AEC-Q100 qualification and extended temperature operation are required.
• Sensor interfacing and data buffering — Uses on-chip RAM and multiple I/O to aggregate, filter and buffer sensor data streams for downstream processing.
• Motor and actuator control — Provides deterministic logic resources and I/O to implement control loops and drive interfaces in embedded control subsystems.
• Embedded system integration — Consolidates glue logic, protocol conversion and peripheral management in a compact surface-mount package for space-constrained boards.

Unique Advantages

• Automotive-qualified design: AEC-Q100 qualification provides a verified baseline for deployment in automotive-grade electronic systems.
• Balanced logic and memory: 3,072 logic elements combined with 36,864 bits of on-chip RAM enable mid-range logic implementations with local buffering needs.
• Compact, manufacturable package: 144-LBGA (144-FPBGA, 13×13) surface-mount package supports dense PCB layouts while simplifying assembly.
• Wide operating temperature: Rated from -40°C to 125°C for reliable operation across harsh thermal environments.
• Controlled-core voltage: Narrow supply window (1.425–1.575 V) helps maintain stable core operation and predictable power budgeting.
• Compliance and sustainability: RoHS status ensures adherence to common environmental regulations for modern electronics production.

Why Choose A3P125-FGG144T?

The A3P125-FGG144T positions itself as a reliable, automotive-qualified FPGA option for engineers needing mid-range logic capacity, local RAM and nearly 100 I/O in a small-footprint LBGA package. Its AEC-Q100 qualification, extended temperature range and RoHS compliance make it suitable for automotive and other harsh-environment embedded systems that demand predictable behavior and long-term robustness.

Choose this device when your design requires a compact, surface-mount FPGA with moderate logic resources, on-chip memory for buffering, and a controlled core voltage for stable system integration.

Request a quote today to receive pricing and availability information for the A3P125-FGG144T.