A3P125-FG144I

The A3P125-FG144I is a ProASIC3 field programmable gate array (FPGA) IC that provides reconfigurable digital logic with on-chip memory and I/O resources. It features 3,072 logic elements, 36,864 bits of embedded RAM, and 97 user I/Os in a 144-LBGA package, and is specified for industrial temperature operation.

This device is supplied for surface-mount assembly and operates from a 1.425 V to 1.575 V core supply, making it suitable for embedded designs that require deterministic, reprogrammable logic in a compact package.

Key Features

• Logic Density  3,072 logic elements (LABs/CLBs) providing 125,000 gates of programmable logic for implementing custom digital functions.
• Embedded Memory  36,864 bits of on-chip RAM to support local buffering, small lookup tables, and state storage without external memory.
• I/O Resources  97 user I/Os to interface with peripherals, sensors, and other system components on a single device.
• Power and Supply  Core voltage specified at 1.425 V to 1.575 V to match system power rails and ensure predictable operating conditions.
• Package and Mounting  144-LBGA (supplier package 144-FPBGA, 13×13) in a surface-mount form factor for compact PCB layouts and automated assembly.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet elevated ambient and industrial environment requirements.
• Mounting Type  Surface mount for compatibility with standard PCB manufacturing and assembly processes.

Typical Applications

• Embedded Control Logic  Implement glue logic, custom state machines, and protocol handling within embedded systems using on-chip programmable resources.
• Interface and I/O Expansion  Provide additional or custom I/O functions for system boards where 97 user I/Os enable versatile peripheral connectivity.
• Prototyping and Development  Use the reprogrammable fabric and on-chip RAM to iterate digital designs and validate logic before committing to fixed-function implementations.

Unique Advantages

• Reconfigurable Logic Capacity:  3,072 logic elements and 125,000 gates supply enough density for a broad set of medium-complexity digital designs.
• Integrated Memory:  36,864 bits of embedded RAM reduce the need for external memory for small buffers and state storage, simplifying board layout.
• Robust I/O Count:  97 user I/Os allow direct interfacing to multiple peripherals and signals without extra bridge devices.
• Industrial Qualification:  Specified for −40 °C to 100 °C operation to support deployment in industrial environments with wider temperature variation.
• Compact, Surface-Mount Package:  144-LBGA (13×13) provides a small PCB footprint for space-constrained designs while supporting automated assembly.
• Controlled Core Voltage:  A defined 1.425 V–1.575 V supply window helps maintain stable device operation and predictable power integration.

Why Choose A3P125-FG144I?

The A3P125-FG144I positions itself as a compact, industrial-grade ProASIC3 FPGA option that balances programmable logic capacity, on-chip RAM, and a robust I/O count in a 144-LBGA surface-mount package. Its specified operating temperature range and defined supply requirements make it suitable for embedded systems requiring reliable, reconfigurable logic.

This device is a fit for developers and procurement teams seeking a mid-density FPGA with integrated memory and ample I/O for prototyping, control logic, and interface consolidation, offering a straightforward path to implement custom digital functions while minimizing external component count.

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