A3P125-2VQG100I

IC FPGA 71 I/O 100VQFP
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 71 36864 100-TQFP

Quantity 698 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package100-VQFP (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case100-TQFPNumber of I/O71Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3072Number of Logic Elements/Cells3072
Number of Gates125000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of A3P125-2VQG100I – ProASIC3 FPGA IC, 71 I/O, 36,864-bit RAM, 100-TQFP

The A3P125-2VQG100I is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology, offered in a 100-pin TQFP package. It provides a mid-range programmable logic solution with 3,072 logic elements, approximately 125,000 gates and 71 general-purpose I/O pins, suitable for industrial applications.

Designed for surface-mount integration, the device combines on-chip memory and flexible I/O with a defined operating voltage window (1.425 V to 1.575 V) and an industrial temperature rating (−40 °C to 100 °C), enabling reliable deployment in controlled embedded and industrial systems.

Key Features

  • Logic Core  3,072 logic elements and approximately 125,000 gates provide a configurable fabric for implementing custom digital functions and mid-range system integration.
  • Embedded Memory  36,864 bits of on-chip RAM for buffering, state storage and small data structures directly within the FPGA fabric.
  • I/O Count  71 user I/O pins accommodate multiple parallel interfaces, sensor connections or control signals without external I/O expanders.
  • Power  Specified supply voltage range of 1.425 V to 1.575 V for device core operation.
  • Package & Mounting  Surface-mount 100-TQFP package (supplier device package: 100-VQFP, 14×14) for compact board-level integration.
  • Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C.
  • Compliance  RoHS compliant for regulatory and environmental considerations.

Typical Applications

  • Industrial Control Systems  Implement custom control logic, I/O handling and deterministic state machines within industrial automation equipment that requires industrial temperature operation.
  • Embedded System Integration  Consolidate glue logic, protocol bridging and peripheral interfaces using the FPGA’s logic elements and 71 I/O pins to reduce external components.
  • Instrumentation and Measurement  Integrate custom processing, timing and data buffering using on-chip RAM and programmable logic for compact instrument designs.
  • Prototyping and Custom Hardware  Rapidly validate and iterate digital designs that need reprogrammable logic and defined I/O counts in a 100‑pin TQFP footprint.

Unique Advantages

  • Right-sized Logic Density: 3,072 logic elements and ~125,000 gates deliver a balance of capacity for mid-range designs without excessive device overhead.
  • Compact Package Integration: 100-TQFP (100‑VQFP, 14×14) surface-mount package simplifies PCB layout for space-constrained boards while keeping a high pin count.
  • Deterministic On-chip Memory: 36,864 bits of embedded RAM enable local buffering and state storage, reducing dependence on external memory for small data tasks.
  • Industrial Temperature Support: Rated from −40 °C to 100 °C for deployment in environments requiring extended temperature range.
  • Narrow Core Voltage Window: Defined supply range (1.425 V–1.575 V) supports predictable power design and supply sequencing in system architectures.
  • Regulatory Compliance: RoHS compliance supports environmental and supply-chain requirements.

Why Choose A3P125-2VQG100I?

The A3P125-2VQG100I positions itself as a practical, industrial-grade FPGA option for engineers needing a mid-density, reprogrammable logic device with a solid complement of I/O and on-chip memory. Its defined electrical and thermal specifications make it suitable for embedded and industrial designs where predictable integration and compact packaging are important.

For projects requiring programmable logic, I/O consolidation and localized memory within a 100-pin surface-mount package, this ProASIC3 device offers a focused balance of integration, environmental rating and component-level compliance to support long-term product development and deployment.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the A3P125-2VQG100I. Include your desired quantity and any specific ordering requirements to receive a prompt response.

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