A3P125-FG144T

The A3P125-FG144T is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides 3,072 logic elements, 36,864 bits of on-chip RAM and 97 user I/O in a compact 144-LBGA package.

Designed with automotive-grade qualification (AEC-Q100) and a wide operating temperature range, this device is suited to embedded control, interface and mid-density programmable logic applications where reliability and compact packaging are required.

Key Features

• Core Logic  Provides 3,072 logic elements (LEs) supporting combinational and sequential logic implementation for mid-density designs.
• Embedded Memory  36,864 bits of on-chip RAM for buffering, FIFOs and small lookup tables.
• Gate Count  Approximately 125,000 gates for mapping glue logic and state-machine functions.
• I/O Resources  97 user I/O pins to connect multiple peripherals, sensors and external devices.
• Power  Core voltage supply range of 1.425 V to 1.575 V for power planning and regulator selection.
• Package & Mounting  144-LBGA package (supplier device package: 144-FPBGA, 13×13), surface-mount for compact board layouts.
• Automotive Qualification  Grade: Automotive with AEC-Q100 qualification for designs requiring automotive-grade silicon.
• Operating Range  Specified operating temperature range from −40 °C to 125 °C for deployed electronic systems.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Automotive control systems  AEC-Q100 qualification and wide temperature range make the device suitable for in-vehicle control and sensor interfacing tasks.
• Embedded interface bridging  97 I/O pins support integration and protocol bridging between multiple peripherals and subsystems.
• Mid-density programmable logic  3,072 logic elements and ~125,000 gates enable implementation of glue logic, state machines and moderate signal-processing blocks.
• Space-constrained designs  144-LBGA (13×13 FPBGA) packaging supports compact PCB layouts where board area is limited.

Unique Advantages

• Automotive-qualified silicon: AEC-Q100 qualification provides a verified baseline for automotive design requirements.
• Balanced resource set: 3,072 logic elements combined with 36,864 bits of RAM delivers a practical balance of logic and memory for mid-range applications.
• High I/O count: 97 user I/Os simplify system integration and reduce the need for external I/O expanders.
• Compact, surface-mount package: 144-LBGA / 144-FPBGA (13×13) supports high-density PCBs and automated assembly.
• Wide temperature capability: Rated from −40 °C to 125 °C to meet demanding environmental requirements.
• Regulated core voltage: Narrow supply range (1.425 V–1.575 V) enables precise power-supply design and predictable operation.

Why Choose A3P125-FG144T?

The A3P125-FG144T positions itself as a reliable mid-density FPGA option for engineers requiring automotive-qualified programmable logic in a compact package. Its combination of 3,072 logic elements, 36,864 bits of on-chip RAM and 97 I/Os delivers the capacity needed for embedded control, interface and glue-logic tasks without excessive board area or power complexity.

With AEC-Q100 qualification, RoHS compliance and a datasheet detailing device characteristics, this ProASIC3 family device is appropriate for designers seeking a qualified, compact FPGA solution for production and deployed environments.

Request a quote or contact sales to obtain pricing, availability and lead-time information for the A3P125-FG144T.