A3P125-FGG144

The A3P125-FGG144 is a ProASIC3 family Field Programmable Gate Array (FPGA) from Microchip Technology. It provides 3,072 logic elements with a capacity of approximately 0.037 Mbits of on-chip RAM, supporting designs up to 125,000 gates with 97 general-purpose I/Os.

Packaged in a 144-pin LBGA (144-FPBGA, 13×13) surface-mount package, the device is specified for commercial applications with a supply voltage range of 1.425 V to 1.575 V and an operating temperature range of 0 °C to 85 °C. The part is RoHS compliant.

Key Features

• Core Logic 3,072 logic elements providing the programmable fabric for combinational and sequential logic implementation.
• Embedded Memory Total on-chip RAM of 36,864 bits (approximately 0.037 Mbits) for small data buffers, state machines, and register storage.
• I/O Capacity 97 device I/Os suitable for interfacing to external peripherals, buses, and control signals.
• Logic Density Up to 125,000 gates of logic to accommodate moderate-complexity digital functions and glue logic.
• Power Supply Operates from a defined core supply voltage range of 1.425 V to 1.575 V for consistent power budgeting and design integration.
• Package & Mounting 144-LBGA (supplier device package 144-FPBGA, 13×13) surface-mount package for compact PCB layouts.
• Commercial Temperature Grade Rated for 0 °C to 85 °C operation, targeting commercial electronic systems.
• RoHS Compliance Environmentally compliant per RoHS requirements.

Typical Applications

• Embedded Control Implement control logic and state machines using 3,072 logic elements and available on-chip RAM for compact embedded designs.
• Interface and Glue Logic Use the 97 I/Os and up to 125,000 gates to bridge and translate between digital peripherals and system buses.
• Custom Peripherals Create tailored peripherals or data-path accelerators within the FPGA fabric leveraging available logic and memory resources.
• Compact, Surface-Mount Designs The 144-LBGA package supports space-constrained PCBs where a surface-mount FPGA is required.

Unique Advantages

• Balanced Logic and Memory: Combines 3,072 logic elements with approximately 0.037 Mbits of RAM to support both control logic and localized data storage.
• High I/O Count: Ninety-seven I/Os enable flexible connectivity for multiple peripherals and external interfaces without external glue components.
• Defined Power Envelope: A tight supply voltage range (1.425 V–1.575 V) simplifies power supply design and consistency across systems.
• Compact Package: The 144-FPBGA (13×13) package provides a small footprint surface-mount solution for board-level integration.
• Commercial Grade Fit: Rated 0 °C to 85 °C, suitable for commercial electronics and products with standard environmental requirements.
• RoHS-Compliant: Meets environmental compliance needs for lead-free assembly and regulatory alignment.

Why Choose A3P125-FGG144?

The A3P125-FGG144 delivers a practical combination of logic density, I/O capability, and on-chip memory in a compact 144-LBGA surface-mount package, making it well suited for commercial electronic designs that require moderate digital integration. Its defined supply and temperature specifications help simplify system-level power and thermal planning.

As a Microchip Technology ProASIC3 device, it provides a predictable implementation platform for customers targeting embedded control, interface logic, and custom peripheral integration, offering a compact, RoHS-compliant option for production and prototyping alike.

Request a quote or submit an inquiry to get pricing and availability for A3P125-FGG144 and to discuss how this FPGA can meet your design requirements.