A3P125-FG144
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 97 36864 144-LBGA |
|---|---|
| Quantity | 715 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-FPBGA (13x13) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LBGA | Number of I/O | 97 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3072 | Number of Logic Elements/Cells | 3072 | ||
| Number of Gates | 125000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of A3P125-FG144 – ProASIC3 Field Programmable Gate Array (FPGA) IC 97 36864 144-LBGA
The A3P125-FG144 is a ProASIC3 FPGA from Microchip Technology, providing reprogrammable logic in a compact 144-LBGA package. It integrates 3,072 logic elements and 125,000 gates with on-chip RAM and a broad set of I/O to address embedded logic, interface consolidation and mid-range programmable logic tasks.
Designed for surface-mount implementation and commercial-grade operation, the device supports a core supply range of 1.425 V to 1.575 V and an operating temperature range of 0 °C to 85 °C, suitable for many standard embedded and electronic systems.
Key Features
- Core Logic — 3,072 logic elements (3072) with 125,000 gates provide a balance of programmable resources for mid-range logic designs.
- Embedded Memory — 36,864 bits of on-chip RAM (~0.037 Mbits) to support data buffering, small FIFOs and state storage without external memory.
- I/O Capability — 97 I/O pins to support multiple interfaces and peripheral connections within a single FPGA device.
- Package and Mounting — 144-LBGA package (supplier device package: 144-FPBGA 13×13) in a surface-mount form factor for compact board integration.
- Power — Core voltage supply range of 1.425 V to 1.575 V for predictable power budgeting in system design.
- Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial applications.
- Compliance — RoHS compliant, supporting regulatory requirements for lead-free manufacturing.
Typical Applications
- Embedded Control — Use the device’s 3,072 logic elements and 97 I/Os for control logic, state machines and peripheral aggregation in embedded systems.
- Interface Bridging — Implement protocol conversion and I/O expansion where moderate logic and on-chip RAM are required without additional discrete components.
- Prototyping and Development — Compact 144-LBGA packaging and surface-mount mounting make the device suitable for prototype boards and production designs that require reprogrammable logic.
Unique Advantages
- Balanced Logic Density: 3,072 logic elements with 125,000 gates deliver a mid-range programmable resource set useful for diverse designs without unnecessary overhead.
- Integrated On-Chip Memory: 36,864 bits of embedded RAM reduces dependence on external memory for small buffers and state storage, simplifying BOM and board routing.
- Generous I/O Count: 97 I/Os enable consolidation of multiple interfaces and peripherals into a single FPGA, reducing the need for extra interface chips.
- Compact Surface-Mount Package: 144-LBGA (144-FPBGA 13×13) provides a space-efficient footprint for compact PCBs and modern manufacturing processes.
- Commercial-Grade Reliability: Rated 0 °C to 85 °C and RoHS compliant for standard commercial product deployments and lead-free assembly flows.
Why Choose A3P125-FG144?
The A3P125-FG144 positions itself as a practical ProASIC3 FPGA option for designers seeking a mid-range, reprogrammable logic device with a solid mix of logic elements, embedded RAM and I/O resources. Its compact 144-LBGA form, surface-mount suitability and defined power and temperature ranges make it appropriate for commercial embedded systems where integration and predictable performance matter.
For development teams and procurement professionals, the device offers a clear balance of performance, integration and manufacturability backed by Microchip Technology. Its resource set supports scalable design approaches where on-chip memory, I/O density and reprogrammability reduce external components and simplify system architecture.
Request a quote or submit an inquiry to obtain pricing, availability and lead-time information for the A3P125-FG144.

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