A3P125-FG144

IC FPGA 97 I/O 144FBGA
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 97 36864 144-LBGA

Quantity 715 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LBGANumber of I/O97Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3072Number of Logic Elements/Cells3072
Number of Gates125000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of A3P125-FG144 – ProASIC3 Field Programmable Gate Array (FPGA) IC 97 36864 144-LBGA

The A3P125-FG144 is a ProASIC3 FPGA from Microchip Technology, providing reprogrammable logic in a compact 144-LBGA package. It integrates 3,072 logic elements and 125,000 gates with on-chip RAM and a broad set of I/O to address embedded logic, interface consolidation and mid-range programmable logic tasks.

Designed for surface-mount implementation and commercial-grade operation, the device supports a core supply range of 1.425 V to 1.575 V and an operating temperature range of 0 °C to 85 °C, suitable for many standard embedded and electronic systems.

Key Features

  • Core Logic — 3,072 logic elements (3072) with 125,000 gates provide a balance of programmable resources for mid-range logic designs.
  • Embedded Memory — 36,864 bits of on-chip RAM (~0.037 Mbits) to support data buffering, small FIFOs and state storage without external memory.
  • I/O Capability — 97 I/O pins to support multiple interfaces and peripheral connections within a single FPGA device.
  • Package and Mounting — 144-LBGA package (supplier device package: 144-FPBGA 13×13) in a surface-mount form factor for compact board integration.
  • Power — Core voltage supply range of 1.425 V to 1.575 V for predictable power budgeting in system design.
  • Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial applications.
  • Compliance — RoHS compliant, supporting regulatory requirements for lead-free manufacturing.

Typical Applications

  • Embedded Control — Use the device’s 3,072 logic elements and 97 I/Os for control logic, state machines and peripheral aggregation in embedded systems.
  • Interface Bridging — Implement protocol conversion and I/O expansion where moderate logic and on-chip RAM are required without additional discrete components.
  • Prototyping and Development — Compact 144-LBGA packaging and surface-mount mounting make the device suitable for prototype boards and production designs that require reprogrammable logic.

Unique Advantages

  • Balanced Logic Density: 3,072 logic elements with 125,000 gates deliver a mid-range programmable resource set useful for diverse designs without unnecessary overhead.
  • Integrated On-Chip Memory: 36,864 bits of embedded RAM reduces dependence on external memory for small buffers and state storage, simplifying BOM and board routing.
  • Generous I/O Count: 97 I/Os enable consolidation of multiple interfaces and peripherals into a single FPGA, reducing the need for extra interface chips.
  • Compact Surface-Mount Package: 144-LBGA (144-FPBGA 13×13) provides a space-efficient footprint for compact PCBs and modern manufacturing processes.
  • Commercial-Grade Reliability: Rated 0 °C to 85 °C and RoHS compliant for standard commercial product deployments and lead-free assembly flows.

Why Choose A3P125-FG144?

The A3P125-FG144 positions itself as a practical ProASIC3 FPGA option for designers seeking a mid-range, reprogrammable logic device with a solid mix of logic elements, embedded RAM and I/O resources. Its compact 144-LBGA form, surface-mount suitability and defined power and temperature ranges make it appropriate for commercial embedded systems where integration and predictable performance matter.

For development teams and procurement professionals, the device offers a clear balance of performance, integration and manufacturability backed by Microchip Technology. Its resource set supports scalable design approaches where on-chip memory, I/O density and reprogrammability reduce external components and simplify system architecture.

Request a quote or submit an inquiry to obtain pricing, availability and lead-time information for the A3P125-FG144.

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