A3P125-PQG208

The A3P125-PQG208 is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology designed for commercial electronic designs requiring programmable logic. It combines 3,072 logic elements with on-chip RAM and a broad I/O count to address a range of programmable-logic tasks in commercial embedded systems.

Key attributes include 133 user I/O, approximately 36.9 Kbits of embedded memory, and a supply voltage range of 1.425 V to 1.575 V, packaged in a 208-BFQFP surface-mount case for board-level integration.

Key Features

• Core Logic  3,072 logic elements providing programmable combinational and sequential resources suitable for implementing custom digital logic.
• On-Chip Memory  Approximately 36.9 Kbits of embedded RAM for buffering, small data structures, and state storage within designs.
• I/O & Gate Capacity  133 user I/O pins and an advertised gate equivalence of 125,000 gates to support diverse peripheral interfacing and glue logic.
• Power  Operates from a core supply voltage range of 1.425 V to 1.575 V for systems targeting this supply domain.
• Package & Mounting  Available in a 208-BFQFP (supplier device package: 208-PQFP, 28×28) surface-mount package suited for PCB assembly.
• Temperature & Grade  Commercial-grade device rated for 0 °C to 85 °C operating temperature.
• RoHS Compliance  RoHS-compliant manufacturing status to meet common environmental requirements.

Typical Applications

• Commercial Embedded Systems  Implement custom control logic, interface glue, and protocol bridging within commercial electronic products that require programmable logic.
• I/O Expansion and Interface  Use available I/O pins and programmable logic to adapt or expand digital interfaces on a board-level system.
• Prototyping and Development  Deploy the device for early-stage hardware prototyping where a fixed-function ASIC is not yet required.

Unique Advantages

• Right-sized Logic Capacity: 3,072 logic elements and 125,000 gate equivalence provide a balanced resource set for mid-range programmable tasks without unnecessary overhead.
• On-chip Memory: Approximately 36.9 Kbits of embedded RAM reduces the need for external memory for small buffers and state machines.
• High I/O Count: 133 user I/O pins allow direct interfacing to multiple peripherals and signals, simplifying board-level design.
• Surface-mount Packaging: 208-BFQFP (28×28) package enables standard PCB assembly workflows for commercial products.
• Commercial Temperature Range: Rated 0 °C to 85 °C for use in typical commercial environments where that range is required.
• Regulatory Readiness: RoHS compliance supports environmental and regulatory considerations for many supply chains.

Why Choose A3P125-PQG208?

The A3P125-PQG208 positions itself as a practical programmable-logic option for commercial electronic designs that need a mid-level logic resource set with significant I/O capability. Its combination of 3,072 logic elements, approximately 36.9 Kbits of embedded RAM, and 133 I/O pins makes it suitable for implementing glue logic, protocol adapters, and custom control functionality while maintaining compact board footprint in a 208-BFQFP surface-mount package.

Designed for commercial temperature operation and produced to RoHS standards, this ProASIC3 device is appropriate for product development and deployment in commercial applications where predictable logic capacity, on-chip memory, and a large I/O count are required.

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