A3P250-1VQ100T

The A3P250-1VQ100T is a ProASIC3 flash-based FPGA from Microchip Technology, offering a compact, surface-mount programmable logic solution in a 100-TQFP package. With 6,144 logic elements and approximately 0.037 Mbits of embedded memory, this device targets applications that require moderate logic density, flexible I/O, and automotive-grade qualification for temperature and reliability.

Key Features

• Core Logic  6,144 logic elements (equivalent to 250,000 gates) provide the programmable logic resources for custom digital functions and glue logic.
• Embedded Memory  Total on-chip RAM: 36,864 bits (approximately 0.037 Mbits) for small buffers, FIFOs, and state storage.
• I/O Capacity  68 user I/O pins support a variety of board-level interfacing and peripheral connections.
• Power Supply  Core voltage specified at 1.425 V to 1.575 V for predictable power design and supply sequencing.
• Package & Mounting  Available in a 100-TQFP (supplier package: 100-VQFP, 14×14 mm) surface-mount package suitable for compact PCB layouts.
• Automotive Qualification & Temperature  AEC-Q100 qualification and an operating temperature range of −40°C to 125°C for deployment in temperature-critical automotive environments.
• Environmental Compliance  RoHS compliant to support regulatory and sustainability requirements.

Typical Applications

• Automotive electronic control units (ECUs)  AEC-Q100 qualification and −40°C to 125°C operation make this FPGA suitable for automotive control and monitoring subsystems.
• Sensor interface and bridging  68 I/O pins and programmable logic enable custom sensor aggregation, protocol bridging, and signal conditioning tasks.
• Compact board-level logic  100-TQFP surface-mount package supports densely packed PCBs where space and package height are constrained.
• On-board peripheral control  6,144 logic elements and on-chip RAM support custom peripheral timing, handshaking, and small buffering implementations.

Unique Advantages

• Automotive-grade qualification: AEC-Q100 qualified with a wide operating temperature range, enabling deployment in rugged vehicle environments.
• Balanced logic and memory: 6,144 logic elements coupled with on-chip RAM provide the right mix for moderate-complexity designs without external memory.
• Predictable power requirements: Tight core voltage specification (1.425 V–1.575 V) simplifies power-supply design and validation.
• Compact package integration: 100-TQFP (100-VQFP, 14×14 mm) surface-mount package helps minimize BOM and board area for space-constrained systems.
• Regulatory and environmental compliance: RoHS compliance supports environmentally conscious designs and manufacturing processes.
• Proven vendor backing: Provided by Microchip Technology, offering continuity and support for embedded design teams.

Why Choose A3P250-1VQ100T?

The A3P250-1VQ100T positions itself as a dependable, automotive-qualified FPGA option for designs that require a moderate number of logic elements, a modest amount of embedded memory, and a reliable I/O count in a compact surface-mount package. Its AEC-Q100 qualification and −40°C to 125°C operating range make it suitable for temperature-sensitive applications where component-level qualification matters.

Engineers and procurement teams designing vehicle electronics, sensor interfaces, or compact embedded systems will find this device useful when they need a Microchip-backed programmable solution that balances integration, thermal robustness, and board-level efficiency.

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