A3P250-1PQG208I

The A3P250-1PQG208I is a ProASIC3 family FPGA from Microchip Technology providing reconfigurable logic for industrial and embedded designs. It combines 6,144 logic elements and 250,000 gates with 36,864 bits of on-chip RAM and 151 user I/O in a 208-pin BFQFP package.

Designed for surface-mount assembly and operation across an industrial temperature range, this device addresses applications that require programmable logic, flexible I/O, and a compact package footprint.

Key Features

• Core Logic 6,144 logic elements (LEs) and approximately 250,000 gates provide capacity for medium-complexity FPGA implementations.
• On-Chip Memory 36,864 bits of embedded RAM (approximately 0.037 Mbits) for small buffers, FIFOs, and local data storage.
• I/O 151 user I/O pins to support a variety of external interfaces and peripheral connections.
• Power Single-core supply range of 1.425 V to 1.575 V to match system power domains and planners.
• Package & Mounting 208-BFQFP package (supplier device package: 208-PQFP, 28×28 mm) optimized for surface-mount PCB assembly.
• Temperature Range Industrial operating range of −40°C to 100°C for deployment in harsh environments.
• Compliance RoHS-compliant manufacturing status for environmental and regulatory alignment.

Typical Applications

• Industrial Automation Implement custom control logic, I/O aggregation, and protocol bridging for factory and process equipment.
• Embedded Systems Provide glue logic, peripheral interfaces, and state-machine implementations in compact embedded products.
• Communications Equipment Support interface adaptation and medium-complexity packet or frame handling where reconfigurable logic is beneficial.
• Instrumentation & Test Drive custom digital control, timing, and data capture functions for test fixtures and measurement devices.

Unique Advantages

• Balanced Logic Capacity: 6,144 logic elements and 250,000 gates enable medium-complexity designs without excessive board-level integration.
• Compact, Assembly-Ready Package: 208-BFQFP in a surface-mount form factor simplifies PCB layout and supports automated production.
• Industrial Temperature Operation: Rated from −40°C to 100°C for reliable operation in demanding environments.
• Flexible I/O Count: 151 user I/O pins accommodate multiple interfaces and peripheral connections on a single device.
• Regulatory Alignment: RoHS compliance supports environmentally conscious product development and procurement.
• Vendor Provenance: Manufactured by Microchip Technology, providing a recognized supply source for FPGA deployments.

Why Choose A3P250-1PQG208I?

The A3P250-1PQG208I positions itself as a practical choice for engineers needing reconfigurable logic with a clear balance of capacity, I/O, and environmental robustness. Its combination of 6,144 logic elements, dedicated on-chip RAM, and 151 I/O in a 208-pin BFQFP supports a broad set of industrial and embedded tasks while fitting standard surface-mount production flows.

For teams targeting medium-complexity FPGA functions where industrial temperature tolerance and RoHS compliance matter, this Microchip ProASIC3 device offers a straightforward, scalable option backed by an established manufacturer.

Request a quote or submit an inquiry to receive pricing and availability information for the A3P250-1PQG208I and to discuss your quantity, lead-time, and technical requirements.