A3P250-1PQG208

The A3P250-1PQG208 is a ProASIC3 Field Programmable Gate Array (FPGA) IC offering 6,144 logic elements and 151 user I/O in a 208-BFQFP package. It provides a compact, commercial-grade programmable logic solution with on-chip RAM for embedded logic and interface functions.

Designed for applications that require configurable digital logic with a high I/O count and defined power and temperature envelopes, this device delivers integration and flexibility for a wide range of electronic designs.

Key Features

• Core Logic — 6,144 logic elements (cells) providing the programmable resources for custom digital designs.
• On-Chip Memory — Approximately 0.037 Mbits (36,864 bits) of embedded RAM for buffering, state storage, and small data structures.
• Programmable I/O — 151 I/O pins to support multiple interfaces and signal domains in a single device.
• Logic Capacity — 250,000 gates for implementing moderate-complexity digital functions and glue logic.
• Power — Defined single-core voltage supply range of 1.425 V to 1.575 V for predictable power budgeting and supply design.
• Package & Mounting — 208-BFQFP (supplier package 208-PQFP, 28 × 28 mm) in a surface-mount form factor for PCB assembly.
• Temperature & Grade — Commercial grade operation across 0 °C to 85 °C for standard ambient environments.
• RoHS Compliance — Device is RoHS compliant to support environmental requirements.

Typical Applications

• Custom Digital Logic — Implement control, state machines, and protocol handling using 6,144 logic elements and 250,000 gates of capacity.
• I/O Expansion and Interface Bridging — Use the 151 I/Os to aggregate or translate signals between multiple subsystems on a single FPGA.
• Embedded Control Functions — Integrate device control and small buffering tasks with approximately 0.037 Mbits of on-chip RAM and available logic resources.

Unique Advantages

• Balanced Logic and I/O Count: 6,144 logic elements paired with 151 I/Os enable versatile partitioning of logic and peripheral interfaces on one device.
• Defined Power Envelope: Narrow supply range (1.425 V–1.575 V) simplifies power-supply design and helps ensure consistent device behavior.
• Compact Surface-Mount Package: The 208-BFQFP (28 × 28 mm) package provides a high pin-count solution in a standard surface-mount footprint for PCB space efficiency.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation, appropriate for a wide range of commercial and office-environment electronics.
• RoHS Compliant: Meets common environmental directives for lead-free assembly and compliance requirements.

Why Choose A3P250-1PQG208?

The A3P250-1PQG208 is positioned as a commercially rated, mid-density FPGA option that combines a substantial logic element count with a high I/O complement in a compact BFQFP package. It is suited for designers needing a configurable device capable of handling custom digital functions, interface consolidation, and modest embedded storage without expanding board-level complexity.

With clearly specified supply and temperature limits and RoHS compliance, this device offers predictable integration into commercial electronic systems while supporting scalable design approaches that leverage programmable logic for product differentiation and rapid iteration.

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