A3P250-1FGG256I

The A3P250-1FGG256I is a ProASIC3 field programmable gate array (FPGA) offered by Microchip Technology. It provides a mid-range, non-volatile FPGA architecture delivering 6,144 logic elements and approximately 0.037 Mbits of embedded memory in a compact BGA package.

Designed for industrial applications, the device combines a defined I/O count and gate capacity with a narrow core supply window and wide operating temperature range, making it suitable for embedded systems and control applications where reliability and deterministic I/O are important.

Key Features

• Core (Logic Capacity) 6,144 logic elements provide mid-range programmable logic resources for glue logic, state machines and custom digital functions.
• Embedded Memory Approximately 0.037 Mbits of on-chip RAM to support packet buffering, small lookup tables and local data storage.
• I/O Resources 157 user I/Os to support a variety of peripheral interfaces and parallel/serial connectivity requirements.
• Gate Count Approximately 250,000 gates, enabling moderate-complexity digital integration on a single device.
• Power Core supply specified at 1.425 V to 1.575 V for defined low-voltage operation.
• Package & Mounting 256-LBGA package (supplier device package: 256-FPBGA, 17×17) with surface-mount mounting for compact PCB designs.
• Temperature & Grade Industrial-grade device rated for operation from -40°C to 100°C, suitable for harsh industrial environments.
• Regulatory RoHS compliant, supporting lead-free manufacturing and environmental requirements.

Typical Applications

• Industrial Control & Automation Use the device to implement control logic, I/O aggregation and protocol bridging in factory automation and process-control systems, leveraging its industrial temperature rating and abundant I/O.
• Embedded System Integration Integrate glue logic, custom interfaces or peripheral controllers in embedded platforms that require a defined logic capacity and on-chip RAM.
• Communications & Interface Bridging Implement protocol translators or timing-critical interface logic where 157 I/Os and moderate gate capacity enable multiple parallel or serial connections.
• Test & Measurement Deploy as configurable logic for data acquisition front-ends, digital preprocessing or timing control in test equipment operating across industrial temperature ranges.

Unique Advantages

• Defined mid-range logic density: 6,144 logic elements and ~250,000 gates deliver predictable capacity for consolidating multiple discrete functions into a single FPGA.
• Compact BGA footprint: 256-LBGA (256-FPBGA, 17×17) enables high-density PCB implementations while maintaining robust I/O counts.
• Industrial temperature support: Rated from -40°C to 100°C for deployment in demanding environmental conditions.
• Low-voltage core operation: 1.425–1.575 V supply window supports consistent power design and helps simplify power sequencing.
• RoHS compliant: Meets lead-free manufacturing requirements for modern assembly processes.

Why Choose A3P250-1FGG256I?

The A3P250-1FGG256I positions itself as a reliable, industrial-grade FPGA for engineers needing a mid-range, non-volatile programmable device with a clear balance of logic, I/O and on-chip memory. Its combination of 6,144 logic elements, 157 I/Os and industrial temperature rating makes it well suited for embedded OEMs and system integrators consolidating discrete logic and interface functions.

With a compact 256-LBGA package and a defined core voltage range, this device supports compact, robust board designs that require predictable power and environmental performance. Choose the A3P250-1FGG256I when you need deterministic I/O, moderate logic capacity and industrial robustness in a single FPGA solution.

Request a quote or submit a procurement inquiry for the A3P250-1FGG256I to receive pricing and availability information tailored to your production needs.