A3P250-1FGG144

The A3P250-1FGG144 is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for commercial applications. It provides a balance of programmable logic capacity, on-chip memory, and I/O count in a compact 144-LBGA package.

With 250,000 gates, 6,144 logic elements and 36,864 bits of embedded RAM, this device addresses designs that require moderate logic density, flexible I/O and board-level integration while operating over standard commercial temperature and supply ranges.

Key Features

• Logic Capacity — 250,000 gates and 6,144 logic elements for implementing custom digital functions and control logic.
• Embedded Memory — 36,864 bits of on-chip RAM to support data buffering, state storage and small memory structures without external devices.
• I/O — 97 I/O pins to support a broad range of peripheral and signal interfacing requirements.
• Power Supply — Operates from a core supply range of 1.425 V to 1.575 V, enabling integration into designs with defined low-voltage core rails.
• Package & Mounting — Supplied in a 144-LBGA (144-FPBGA, 13×13) package for surface-mount board assembly and compact footprint.
• Operating Range — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory — RoHS compliant.

Typical Applications

• Commercial Embedded Systems — Implement control, glue-logic and custom digital functions where a commercial-grade FPGA with moderate logic and I/O is required.
• Board-Level Integration — Compact 144-LBGA package and surface-mount mounting enable tight board layouts and space-constrained designs.
• Custom Logic and Prototyping — Use the device to validate and deploy custom logic partitions that fit within 6,144 logic elements and 97 I/Os.
• I/O-Intensive Interfaces — Suitable for designs that require multiple external connections, supported by the device's 97 I/O pins.

Unique Advantages

• High Logic Density: 250,000 gates and 6,144 logic elements provide substantial programmable resources for medium-complexity designs.
• On-Chip RAM: 36,864 bits of embedded memory reduce dependence on external memory for small buffers and state machines.
• Ample I/O: 97 I/Os allow flexible interfacing to peripherals, sensors and other board-level components.
• Compact Packaging: 144-LBGA (13×13) delivers a small footprint for space-conscious applications while supporting surface-mount assembly.
• Commercial Qualification: Rated for 0 °C to 85 °C operation and RoHS compliance to meet common commercial product requirements.
• Predictable Power Envelope: Core supply range of 1.425 V to 1.575 V aligns with typical low-voltage FPGA power architectures.

Why Choose A3P250-1FGG144?

The A3P250-1FGG144 positions itself as a commercial-grade FPGA option for engineers needing a balance of logic capacity, embedded memory and I/O in a compact package. Its 250,000 gates and 6,144 logic elements make it well-suited to board-level designs that require significant programmable logic without moving to larger packages.

Backed by Microchip Technology and supplied in a 144-LBGA surface-mount package, this device offers predictable electrical and thermal characteristics for commercial applications, providing a clear platform for designs that require moderate logic density, integrated RAM and a substantial number of I/Os.

Request a quote or submit an inquiry to check availability and pricing for the A3P250-1FGG144 and to discuss how it fits your next commercial FPGA design.