A3P250-1FG144T

The A3P250-1FG144T is a ProASIC3 field programmable gate array from Microchip Technology. It provides a compact, automotive‑grade programmable logic device combining logic elements, embedded RAM and a substantial I/O count in a 144‑LBGA package.

With 6,144 logic elements, 36,864 bits of on‑chip RAM and 97 I/Os, this device addresses designs that require programmable digital logic, moderate on‑chip memory and wide operating temperature and qualification for automotive applications.

Key Features

• Logic Capacity — 6,144 logic elements (cells) for implementing custom digital functions and control logic.
• Embedded Memory — 36,864 bits of total on‑chip RAM for buffering, small data structures and state storage without external memory.
• I/O Resources — 97 general purpose I/Os to connect sensors, actuators, peripherals and external interfaces.
• Gate Complexity — 250,000 gates to support moderately complex logic implementations.
• Power — Core supply range of 1.425 V to 1.575 V to match low‑voltage system rails.
• Package & Mounting — 144‑LBGA package (supplier device package: 144‑FPBGA 13×13) for high pin density in a surface‑mount form factor.
• Automotive Qualification — AEC‑Q100 qualification and designated Automotive grade for applications requiring that certification.
• Temperature Range — Rated for operation from −40 °C to 125 °C to support wide‑temperature deployments.
• Environmental Compliance — RoHS compliant for regulatory and manufacturing consistency.

Typical Applications

• Automotive Electronics — Implement in‑vehicle control, interfacing or custom logic blocks where AEC‑Q100 qualification and wide temperature range are required.
• Embedded Control — Use for programmable controllers and real‑time logic in systems that need moderate on‑chip RAM and multiple I/Os.
• Interface Bridging — Implement custom protocol bridging, signal conditioning or I/O expansion using the device's 97 I/Os and logic resources.
• Prototyping and Custom Logic — Deploy for proof‑of‑concept and small production runs requiring reprogrammable logic with a compact BGA footprint.

Unique Advantages

• Automotive‑grade qualification: AEC‑Q100 certification combined with −40 °C to 125 °C operation supports deployment in demanding automotive environments.
• Balanced on‑chip resources: 6,144 logic elements and 36,864 bits of RAM provide a balanced mix of programmable logic and embedded memory for many control and interface tasks.
• High I/O count in compact package: 97 I/Os in a 144‑LBGA (13×13 FPBGA) surface‑mount package enables dense board designs without sacrificing connectivity.
• Moderate gate capacity: 250,000 gates enable implementation of substantial custom digital functions while keeping board footprint and BOM streamlined.
• Low‑voltage core support: 1.425–1.575 V core voltage aligns with low‑voltage system architectures.
• Regulatory readiness: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose A3P250-1FG144T?

The A3P250-1FG144T is positioned for designs that need a reliable, automotive‑qualified programmable logic device with a strong balance of logic capacity, on‑chip memory and I/O density. Its 144‑LBGA surface‑mount package and low‑voltage core make it suitable for compact, production‑oriented boards where qualification and temperature range matter.

This device is a practical choice for engineers and procurement teams targeting applications that require AEC‑Q100 qualification, a wide operating temperature window and a moderate ensemble of programmable resources for control, interfacing and custom logic functions.

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