A3P250-1FG144M

The A3P250-1FG144M is a ProASIC3 field programmable gate array by Microchip Technology, providing a compact, military-grade programmable logic solution. It combines 6,144 logic elements with on-chip RAM and 97 general-purpose I/O in a 144-LBGA package for designs that require qualification to MIL-STD-883 and extended temperature operation.

This device is suited for applications that need robust, qualified programmable logic in a surface-mount 13×13 144-FPBGA footprint, offering a defined low-voltage core and wide operating temperature range for demanding environments.

Key Features

• Logic Capacity — 6,144 logic elements (LEs) supporting custom digital logic and control functions.
• On-Chip Memory — Approximately 0.037 Mbits of embedded memory (36,864 total RAM bits) for buffering, state storage, and small lookup tables.
• Gate Equivalent — 250,000 gates to describe medium-complexity programmable logic functions.
• I/O Count — 97 user I/O pins to interface with peripherals, sensors, and external logic.
• Package & Mounting — 144-LBGA package (supplier device package: 144-FPBGA, 13×13) with surface-mount mounting for space-efficient board layouts.
• Power — Core supply voltage range 1.425 V to 1.575 V, enabling defined low-voltage system integration.
• Qualification & Grade — Military grade with MIL-STD-883 qualification for use in high-reliability applications.
• Operating Temperature — Rated for −55°C to 125°C to support extended-temperature deployments.
• Environmental — RoHS compliant.

Typical Applications

• Military and Aerospace Systems — Deploy MIL-STD-883 qualified programmable logic where extended temperature range and robust qualification are required.
• Rugged Embedded Control — Implement control logic and interfacing in systems that must operate between −55°C and 125°C using the device’s 97 I/O and 6,144 logic elements.
• Custom I/O and Glue Logic — Replace discrete components with programmable logic for protocol bridging, I/O expansion, and tailored timing functions.

Unique Advantages

• MIL-STD-883 Qualification: Provides documentation and assurance needed for military-grade hardware development and procurement.
• Extended Temperature Capability: −55°C to 125°C rating supports reliable operation in harsh and temperature-extreme environments.
• Compact, High-Density Package: 144-LBGA (13×13 FPBGA) enables high I/O and logic count in a small board area to reduce PCB footprint.
• Balanced Logic and Memory Resources: 6,144 logic elements paired with ~0.037 Mbits of embedded RAM support medium-complexity designs with local storage needs.
• Defined Low-Voltage Core: 1.425–1.575 V supply range simplifies power budgeting for systems using low-voltage cores.
• RoHS Compliant: Meets environmental compliance requirements for modern electronics manufacturing.

Why Choose A3P250-1FG144M?

The A3P250-1FG144M positions itself as a military-grade programmable logic device that combines a useful balance of logic density, I/O capability, and embedded memory in a compact 144-LBGA package. Its MIL-STD-883 qualification and −55°C to 125°C operating range make it appropriate for designers prioritizing reliability and environmental robustness.

Manufactured by Microchip Technology, this FPGA is suitable for engineering teams developing rugged embedded systems, mission-critical control logic, and custom I/O solutions that require a qualified, surface-mount programmable device with clearly defined electrical and thermal limits.

Request a quote or contact sales to check availability and pricing for the A3P250-1FG144M and discuss how it can fit your next qualified embedded design.