A3P250-1FG256I

The A3P250-1FG256I is a ProASIC3 field programmable gate array (FPGA) designed for configurable digital logic in industrial applications. It provides 6,144 logic elements, approximately 0.037 Mbits of embedded memory, and 157 user I/O pins in a compact 256-LBGA package.

With a supply voltage window of 1.425 V to 1.575 V and an operating temperature range of −40 °C to 100 °C, this device targets designs that require programmable logic capacity combined with industrial-temperature operation and RoHS compliance.

Key Features

• Logic Resources  6144 logic elements supporting custom digital logic and mid-size FPGA implementations.
• Embedded Memory  Total on-chip memory of 36,864 bits—approximately 0.037 Mbits—for small data buffers and state storage.
• I/O and Gate Count  157 user I/O pins and 250,000 gates to interface with peripherals and implement complex logic functions.
• Power  Single-core voltage supply range of 1.425 V to 1.575 V to match target power-rail requirements.
• Package & Mounting  256-LBGA package (supplier package: 256-FPBGA, 17×17) in a surface-mount form factor for compact PCB layouts.
• Temperature & Grade  Industrial grade operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance  RoHS compliant construction.

Typical Applications

• Industrial Control Systems  Programmable logic and industrial-temperature tolerance support control, sequencing, and custom I/O functions.
• Communications Interfaces  Multiple I/O and substantial gate count enable implementation of protocol bridging and interface logic.
• Embedded System Glue Logic  Use the FPGA’s logic elements and on-chip memory for custom glue logic, data routing, and small buffering tasks.

Unique Advantages

• Industrial-temperature capability: Rated from −40 °C to 100 °C for reliable operation in harsh environments.
• Balanced logic capacity: 6,144 logic elements and 250,000 gates provide room for mid-range FPGA designs without excessive footprint.
• Compact BGA footprint: 256-LBGA / 256-FPBGA (17×17) packaging reduces PCB area while supporting surface-mount assembly.
• Constrained supply range: Defined 1.425 V to 1.575 V supply window simplifies power-rail design and integration.
• RoHS compliant: Meets environmental regulatory expectations for lead-free assemblies.

Why Choose A3P250-1FG256I?

The A3P250-1FG256I combines a practical balance of logic elements, on-chip memory, and I/O density in a compact, industrial-temperature package. Its specification set makes it suitable for engineers seeking a configurable device that can be deployed in temperature-challenging environments while maintaining a small PCB footprint.

This FPGA is a solid choice for projects requiring mid-size programmable logic, deterministic power requirements, and RoHS-compliant assembly—offering predictable integration into industrial and embedded designs.

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