A3P250-1FGG144T

The A3P250-1FGG144T is a field programmable gate array (FPGA) from Microchip Technology's ProASIC3 family designed for embedded and automotive applications. It provides a balance of logic capacity, I/O count and on-chip memory suitable for control, interfacing and mixed-signal glue logic tasks where qualification and operating range are important.

Key attributes include 6,144 logic elements, approximately 0.037 Mbits of embedded RAM, 97 I/Os, AEC-Q100 qualification and a wide operating temperature range, making it appropriate for designs that require qualified components and compact BGA packaging.

Key Features

• Logic Capacity — 6,144 logic elements delivering logic resources equivalent to approximately 250,000 gates for implementing combinational and sequential designs.
• Embedded Memory — Approximately 0.037 Mbits (36,864 bits) of on-chip RAM for buffering, small LUT-based storage and state retention.
• I/O — 97 general-purpose I/O pins to support multiple peripheral interfaces and signal routing.
• Package & Mounting — 144-LBGA package (supplier package: 144-FPBGA, 13×13) in a surface-mount form factor for compact PCB layouts.
• Power — Core supply voltage range from 1.425 V to 1.575 V for predictable power budgeting and system integration.
• Temperature & Qualification — Qualified to AEC-Q100 with an operating temperature range of −40 °C to 125 °C, supporting automotive-grade thermal requirements.
• Regulatory — RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• Automotive electronic systems — AEC-Q100 qualification and −40 °C to 125 °C operation suit the part for vehicle electronic control modules and sensor interface functions.
• Embedded control — 6,144 logic elements and on-chip RAM enable control logic, protocol bridging and deterministic finite-state implementations in compact systems.
• Space-constrained designs — 144-LBGA surface-mount package and 97 I/Os provide a small-footprint programmable solution for addressing I/O-intensive tasks on dense PCBs.

Unique Advantages

• AEC-Q100 qualified for automotive use: Explicit AEC-Q100 qualification supports deployment in automotive applications that require component-level qualification.
• Balanced logic and memory: 6,144 logic elements paired with 36,864 bits of embedded RAM enable a mix of control logic and modest buffering in a single device.
• Generous I/O count: 97 I/Os allow flexible interfacing to sensors, actuators and peripheral devices without additional IO expanders.
• Compact BGA packaging: 144-LBGA (144-FPBGA 13×13) and surface-mount mounting simplify placement on high-density PCBs while conserving board area.
• Industry-compliant environmental profile: RoHS compliance reduces material and process constraints for production and procurement.
• Defined power envelope: Narrow core voltage range (1.425 V–1.575 V) helps designers establish stable power delivery and decoupling strategies.

Why Choose A3P250-1FGG144T?

The A3P250-1FGG144T positions itself as a qualified, compact FPGA option that combines a practical logic element count, on-chip memory and a high I/O density within a small BGA package. Its AEC-Q100 qualification and −40 °C to 125 °C operating range make it appropriate for projects that require automotive-grade components and robust thermal performance.

Choose this device when you need a Microchip ProASIC3 FPGA with defined power requirements, a reliable qualification pedigree and the I/O and logic resources to consolidate control and interfacing functions on a single, surface-mount package.

Request a quote or contact sales to discuss availability, lead times and pricing for the A3P250-1FGG144T.