A3P250-1FGG256

The A3P250-1FGG256 is a ProASIC3 Field Programmable Gate Array (FPGA) from Microchip Technology. It provides a balanced combination of logic resources, on-chip memory and I/O count in a compact 256-ball L-BGA package for commercial embedded and digital designs.

With 6,144 logic elements, approximately 36.9 kbits of on-chip RAM and 157 available I/Os, the device is suitable for applications that require moderate logic density, integrated memory and a high pin count within a surface-mount package. The part operates from a 1.425 V to 1.575 V supply and is rated for commercial temperature operation (0 °C to 85 °C).

Key Features

• Logic Capacity  6,144 logic elements (cells) providing up to 250,000 gates of programmable logic for moderate-density digital designs.
• On-chip Memory  Approximately 36.9 kbits of embedded RAM to support local buffering, state machines and temporary data storage.
• I/O Density  157 general-purpose I/Os for interfacing to peripherals, sensors and external logic devices.
• Supply Voltage  Narrow operating supply range of 1.425 V to 1.575 V to match system power rails in low-voltage designs.
• Package & Mounting  256-LBGA (supplier package: 256-FPBGA 17×17) in a surface-mount form factor for compact PCB layouts.
• Operating Range  Commercial grade operation from 0 °C to 85 °C for mainstream commercial electronics applications.
• Regulatory  RoHS compliant to support lead-free assembly and environmental requirements.

Typical Applications

• Embedded control and glue logic  Use the device to implement custom control logic, protocol bridging and system glue functions where moderate logic density and flexible I/O are required.
• Interface and peripheral aggregation  Aggregate and adapt multiple peripheral signals using the 157 available I/Os to streamline board-level connectivity.
• Sensor and data buffering  Leverage on-chip RAM for temporary data storage and buffering in sensor acquisition and signal-processing front ends.

Unique Advantages

• Balanced resource mix: Combines 6,144 logic elements, ~36.9 kbits of RAM and 157 I/Os to address a wide range of mid-density design requirements without overspecifying the bill of materials.
• Compact, manufacturable package: 256-LBGA surface-mount package (256-FPBGA 17×17) enables dense PCB placement and automated assembly processes.
• Low-voltage operation: Tight supply range (1.425 V–1.575 V) supports integration into low-voltage digital systems and simplifies power-rail planning.
• Commercial temperature rating: 0 °C to 85 °C suitability for mainstream commercial and consumer electronic products.
• Regulatory compliance: RoHS compliance supports lead-free manufacturing and environmental requirements for modern electronics production.

Why Choose A3P250-1FGG256?

The A3P250-1FGG256 offers a practical mix of logic, memory and I/O in a compact 256-LBGA surface-mount package, making it well suited for commercial embedded designs that require moderate gate counts and flexible interfacing. Its specification set — including 6,144 logic elements, approximately 36.9 kbits of on-chip RAM, 157 I/Os, and a defined 1.425 V to 1.575 V supply range — provides clear parameters for integration into board-level systems.

Designed and supplied by Microchip Technology, the device provides predictable electrical and mechanical characteristics for product development teams building or scaling mainstream digital and embedded applications where commercial-grade temperature and RoHS compliance are required.

Request a quote or submit an inquiry to check availability and pricing for the A3P250-1FGG256. Our team can provide lead-time and purchasing options tailored to your project needs.