A3P250-1FGG144I

The A3P250-1FGG144I is a ProASIC3 Field Programmable Gate Array from Microchip Technology, offering a mid-range logic device in a compact package. It provides a balance of logic capacity, on-chip memory and I/O for industrial applications requiring programmable logic in a surface-mount LBGA footprint.

With 6,144 logic elements, approximately 0.037 Mbits of embedded RAM and 97 user I/O, this device is intended for designs that require configurable digital logic, moderate embedded memory, and reliable operation across an industrial temperature range.

Key Features

• Logic Capacity — 6,144 logic elements (reported as CLBs/LABs) supporting up to 250,000 gates for implementing mid-density digital logic and control functions.
• Embedded Memory — Approximately 0.037 Mbits of on-chip RAM (36,864 bits) for buffering, small FIFOs, and local data storage.
• I/O Count — 97 general-purpose I/O pins to interface with sensors, actuators, peripherals and external memories.
• Power — Operates from a core supply range of 1.425 V to 1.575 V, enabling designs targeting a ~1.5 V core rail.
• Package & Mounting — 144-LBGA package, supplier designation 144-FPBGA (13×13), designed for surface-mount assembly in compact board layouts.
• Temperature Range — Industrial-grade operation from −40 °C to 100 °C for deployment in demanding environments.
• Regulatory — RoHS compliant, supporting environmental and manufacturing requirements.

Typical Applications

• Industrial Control — Implement custom control logic and I/O aggregation for factory automation and process control systems that require industrial temperature operation.
• Embedded Interfaces — Bridge and manage multiple sensors, actuators or peripheral buses using the device’s 97 I/O pins and on-chip logic.
• Signal & Data Conditioning — Perform moderate digital signal processing or protocol adaptation where local RAM and 6,144 logic elements meet system requirements.

Unique Advantages

• Industrial Temperature Capability: Rated for −40 °C to 100 °C, enabling deployment in harsh and temperature-variable environments.
• Compact LBGA Package: 144-LBGA (13×13) provides a small board footprint while delivering substantial I/O and logic resources.
• Balanced Logic and Memory: Combination of 6,144 logic elements and 36,864 bits of RAM supports a wide range of mid-density designs without external memory for small buffers.
• Moderate I/O Density: Ninety-seven user I/Os make it practical for systems that need to connect multiple peripherals or sensors directly to the FPGA.
• RoHS Compliant: Meets common environmental manufacturing requirements for lead-free assembly.

Why Choose A3P250-1FGG144I?

The A3P250-1FGG144I positions itself as a mid-density, industrial-grade FPGA that combines a practical number of logic elements, embedded RAM and a nearly 100-pin I/O complement in a compact LBGA package. Its supply and temperature specifications make it suited for engineers designing industrial and embedded systems that require programmable logic with defined thermal and power limits.

This device is appropriate for teams seeking a programmable solution that balances integration and board-space efficiency while maintaining RoHS compliance and industrial temperature operation. It is an option for designs where moderate gate count, local memory and flexible I/O are required within a surface-mount LBGA form factor.

Request a quote or submit an inquiry today to check availability, pricing and lead time for the A3P250-1FGG144I.