A3P250-1FG256

The A3P250-1FG256 is a ProASIC3 family field programmable gate array (FPGA) offered in a 256-LBGA package. It provides a mid-density programmable fabric with dedicated on-chip memory and a substantial number of I/O for commercial embedded designs.

This device targets applications that require customizable digital logic, moderate on-chip memory, and a compact surface-mount package while operating within a commercial temperature range.

Key Features

• Logic Capacity — 6,144 logic elements (CLBs), enabling integration of custom digital functions and moderate-complexity designs.
• Embedded Memory — Approximately 36.9 kbits of on-chip RAM (36,864 total RAM bits) for buffering, small data storage, and state machines.
• Gate Count — 250,000 gates to support a variety of programmable logic implementations.
• I/O — 157 user I/O pins suitable for interfacing with peripherals, sensors, and external logic devices.
• Power — Device core supply range of 1.425 V to 1.575 V for systems designed to this voltage domain.
• Package & Mounting — 256-LBGA package (supplier device package: 256-FPBGA 17×17) in a surface-mount form factor for compact board integration.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory — RoHS compliant for reduced hazardous substances in manufacturing.

Typical Applications

• Embedded Control — Implements custom control logic, finite state machines, and glue logic in commercial embedded systems.
• Consumer Electronics — Provides configurable I/O and programmable logic for feature-rich consumer devices requiring mid-density FPGA resources.
• Communications & Interfaces — Acts as protocol glue, interface bridging, or custom serializer/deserializer logic using its I/O resources.
• Test & Measurement — Implements custom signal processing blocks, trigger logic, or data handling for bench and production test equipment.

Unique Advantages

• Balanced Logic and Memory: 6,144 logic elements combined with 36,864 bits of on-chip RAM provide a balanced resource set for many mid-range designs.
• Compact Surface-Mount Package: 256-LBGA (256-FPBGA 17×17) enables high-density board layouts while keeping the overall footprint small.
• Rich I/O Count: 157 I/O pins allow flexible interfacing with multiple peripherals and external devices without external bridge logic.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C to match typical commercial product environments and deployment.
• Regulatory Compliance: RoHS compliance simplifies procurement and manufacturing for markets requiring reduced hazardous substances.

Why Choose A3P250-1FG256?

The A3P250-1FG256 positions itself as a mid-density programmable solution that balances logic capacity, embedded RAM, and I/O count in a compact 256-LBGA surface-mount package. Its 250,000-gate equivalent architecture and 6,144 logic elements make it well suited for designers who need customizable digital logic without moving to larger FPGA families.

Ideal for teams developing commercial embedded systems, consumer products, communications interfaces, or test equipment, this ProASIC3 FPGA offers a clear combination of performance, integration, and manufacturability—backed by RoHS compliance and defined operating and supply ranges for predictable system-level design.

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