A3P250-1FG144I

The A3P250-1FG144I is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology. It provides mid-range programmable logic resources and I/O density in a compact 144-LBGA package for embedded and industrial designs.

With 6,144 logic elements, 97 user I/O pins and an industrial operating range, this device is suited to applications that require on-board programmable logic, local memory and a small package footprint.

Key Features

• Core Logic — 6,144 logic elements supporting approximately 250,000 gates of programmable logic capacity.
• Embedded Memory — 36,864 bits of on-chip RAM (approximately 0.037 Mbits) for local buffering and state storage.
• I/O — 97 available I/O pins to support multiple peripheral and interface connections.
• Power — Defined supply voltage range of 1.425 V to 1.575 V for the core.
• Package & Mounting — 144-LBGA package; supplier device package listed as 144-FPBGA (13×13). Surface-mount device suitable for compact board layouts.
• Temperature & Grade — Industrial grade device rated for operation from -40 °C to 100 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Implement programmable control logic and I/O aggregation in systems that require an industrial temperature range and reliable on-board logic.
• Embedded Interface and Glue Logic — Use the device’s 6,144 logic elements and on-chip RAM to implement protocol bridging, custom peripherals and interface processing.
• Communications and Instrumentation — Provide compact, reconfigurable logic and multiple I/Os for signal routing, formatting and local processing in compact instrument designs.

Unique Advantages

• Balanced Programmable Capacity: 6,144 logic elements and roughly 250,000 gates provide the resources needed for moderate-complexity logic implementations without excess footprint.
• On-Chip Memory: 36,864 bits of embedded RAM enable local buffering and state retention close to logic functions, reducing external memory needs.
• High I/O Density in Compact Package: 97 I/Os in a 144-LBGA (144-FPBGA 13×13) footprint optimizes board area while maintaining connectivity.
• Industrial Temperature Range: Rated from -40 °C to 100 °C to meet environmental demands of industrial deployments.
• Defined Core Supply: Narrow supply window (1.425–1.575 V) simplifies power-supply selection and design verification.
• RoHS Compliant: Meets environmental compliance requirements for lead-free assembly.

Why Choose A3P250-1FG144I?

The A3P250-1FG144I delivers a practical combination of programmable logic capacity, on-chip memory and I/O density in a compact LBGA package, targeted at embedded and industrial designs that require reliable operation across a wide temperature range. Its specification set makes it well suited for engineers seeking a mid-range FPGA solution from Microchip Technology for glue logic, interface processing and control functions.

Choosing this device provides a balanced option for projects that need reconfigurable logic, local RAM resources and a high I/O count while maintaining a compact board footprint and industrial environmental capability.

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