A3P125-VQG100T

The A3P125-VQG100T is a ProASIC3 Field Programmable Gate Array (FPGA) IC designed for reliable embedded logic integration. It delivers 3,072 logic elements, approximately 36,864 bits of on-chip RAM, and 71 I/O pins in a 100-TQFP surface-mount package.

Qualified to AEC-Q100 and specified for operation from -40 °C to 125 °C, this device targets automotive and other environments that require extended temperature operation, combined with a low-voltage core supply of 1.425 V to 1.575 V.

Key Features

• Core Logic 3,072 logic elements (cells) supporting up to 125,000 gates for customizable digital functions and glue logic.
• Embedded Memory 36,864 bits of on-chip RAM to store configuration data, small buffers, and application state without external memory.
• I/O Density 71 I/O pins provide flexible external interfacing for sensors, actuators, and peripheral devices.
• Power Supply Core voltage specified from 1.425 V to 1.575 V to match low-voltage system domains and help manage power consumption.
• Package & Mounting Available in a 100-TQFP (100-VQFP, 14 × 14 mm supplier package) surface-mount package for PCB assemblies requiring a compact, leaded TQFP footprint.
• Automotive Qualification AEC-Q100 qualification and an operating range of -40 °C to 125 °C support deployment in automotive-grade systems.
• Environmental Compliance RoHS compliant to meet common lead-free manufacturing requirements.

Typical Applications

• Automotive embedded systems — Suited for vehicle electronics where AEC-Q100 qualification and -40 °C to 125 °C operation are required.
• Industrial control — 71 I/O and on-chip memory enable control logic, signal interfacing, and moderate I/O aggregation in industrial environments.
• Sensor interfacing — Use the device’s I/O density and logic resources to implement sensor conditioning, filtering, and protocol bridging.
• Low-voltage embedded designs — Core supply of 1.425 V to 1.575 V supports integration into low-voltage system domains.

Unique Advantages

• AEC-Q100 Automotive Qualification: Explicit qualification for automotive use provides confidence for in-vehicle applications and long-term reliability planning.
• Balanced Logic and Memory: The combination of 3,072 logic elements and 36,864 bits of RAM supports a wide range of mid-density logic and buffering tasks without external memory.
• Flexible I/O Count: 71 I/O pins allow direct interfacing to multiple peripherals and sensors, reducing external glue logic.
• Compact Surface-Mount Package: 100-TQFP package offers a compact footprint for space-constrained PCB designs while maintaining accessible pinout.
• Wide Operating Temperature: Rated from -40 °C to 125 °C to meet harsh-environment requirements common in automotive and industrial applications.
• RoHS Compliant: Conforms to lead-free manufacturing standards for regulatory and process compatibility.

Why Choose A3P125-VQG100T?

The A3P125-VQG100T positions itself as a reliable mid-density FPGA option for designs that require automotive-grade qualification, extended temperature operation, and compact packaging. With 3,072 logic elements, 36,864 bits of on-chip RAM, and 71 I/O, it enables implementation of control, interfacing, and buffering functions without extensive external components.

This device is appropriate for engineering teams seeking a qualified FPGA solution that balances integration, temperature resilience, and a low-voltage core supply—supporting long-term designs where robustness and predictable BOM count are important.

Request a quote or submit an inquiry for pricing and availability of the A3P125-VQG100T to evaluate it for your next design.