A3P250-1FG144

The A3P250-1FG144 is a ProASIC3 Field Programmable Gate Array (FPGA) from Microchip Technology intended for commercial embedded designs. It provides a mid-range logic capacity with integrated on-chip memory and a dense I/O complement in a compact 144-LBGA package.

With 6,144 logic elements, approximately 36.9 kbits of embedded memory and 97 I/O pins, this device targets applications that require moderate programmable logic, controlled power rails and a small BGA footprint for surface-mount assembly.

Key Features

• Core Logic  6,144 logic elements (cells) and approximately 250,000 gates provide mid-range programmable logic capacity for custom digital functions.
• Embedded Memory  Total on-chip RAM of 36,864 bits (approximately 36.9 kbits) to support registers, FIFOs and small buffering requirements.
• I/O Density  97 input/output pins for interfacing with peripherals, sensors and external logic.
• Power Supply  Operates from a defined core voltage range of 1.425 V to 1.575 V for predictable power planning.
• Package & Mounting  144-LBGA package (supplier device package: 144-FPBGA, 13×13 mm) designed for surface-mount PCB assembly.
• Operating Range  Commercial-grade operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant for regulatory alignment in commercial products.

Unique Advantages

• Balanced logic and memory: 6,144 logic elements paired with on-chip RAM support a wide range of mid-size logic implementations without immediate external memory dependence.
• Compact BGA footprint: 144-LBGA (13×13 mm) package enables higher I/O density in space-constrained PCB layouts.
• Predictable power envelope: Narrow core voltage window (1.425 V–1.575 V) simplifies power-supply design and margining.
• Ample I/O count: Ninety-seven I/O pins accommodate multiple peripheral interfaces and signal domains.
• Commercial-grade suitability: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial product programs.

Why Choose A3P250-1FG144?

The A3P250-1FG144 positions itself as a practical choice for commercial embedded designs that need moderate programmable logic, modest embedded memory and a high I/O count in a compact surface-mount BGA package. Its specifications support integration of custom logic, interfacing and buffering while fitting production workflows that require RoHS compliance and standard commercial temperature ratings.

Manufactured by Microchip Technology and identified as part of the ProASIC3 FPGA family, this device is suited for teams seeking a mid-range FPGA solution that balances integration density, power definition and assembly-friendly packaging.

Request a quote or submit an inquiry to obtain pricing and availability for the A3P250-1FG144.