A3P250-1FG256T

The A3P250-1FG256T is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology designed for mid-range, I/O-rich embedded designs. It provides a balance of logic capacity, on-chip memory, and I/O count suited to applications that require qualified, robust components.

This device is delivered in a compact 256-LBGA surface-mount package and is specified for automotive-grade use with AEC-Q100 qualification. Key electrical and environmental limits include a supply voltage range of 1.425 V to 1.575 V and an operating temperature range from -40 °C to 125 °C.

Key Features

• Core Logic  6144 logic elements (logic cells) and a gate count of 250,000 provide mid-range combinational and sequential capability for custom digital functions.
• Embedded Memory  Total on-chip RAM of 36,864 bits supports local buffering, FIFOs, and small data tables without external memory.
• I/O Density  157 user I/O pins enable broad peripheral connectivity and interface consolidation on a single device.
• Package & Mounting  256-LBGA (supplier package: 256-FPBGA, 17×17) in a surface-mount form factor for dense PCB implementations.
• Power  Narrow supply voltage range of 1.425 V to 1.575 V supports controlled power-domain designs.
• Automotive Qualification  Grade: Automotive with AEC-Q100 qualification for designs requiring recognized automotive component qualification.
• Temperature Range  Operating temperature from -40 °C to 125 °C for applications exposed to a wide thermal envelope.
• Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Automotive systems  Qualified for automotive use (AEC-Q100), suitable for in-vehicle control and interface tasks that require reliable components across temperature extremes.
• Embedded control  Mid-range logic capacity and on-chip RAM make the device suitable for embedded controllers and custom digital processing blocks.
• I/O-intensive interface modules  High I/O count enables aggregation and bridging of multiple peripherals and sensors on a single FPGA.
• Temperature-demanding environments  Rated operation from -40 °C to 125 °C for applications with stringent thermal requirements.

Unique Advantages

• AEC-Q100 automotive qualification: Ensures the device meets a recognized automotive component reliability standard.
• Balanced logic and gate capacity: 6144 logic elements and 250,000 gates provide sufficient resources for mid-range custom logic without unnecessary overhead.
• High I/O count: 157 I/Os simplify system design by reducing the need for external interface components.
• Compact LBGA package: 256-LBGA (17×17 FPBGA) supports high-density board layouts while maintaining surface-mount manufacturability.
• Wide operating temperature range: -40 °C to 125 °C supports deployment in thermally challenging environments.
• RoHS compliance: Meets common environmental regulations for modern electronics manufacturing.

Why Choose A3P250-1FG256T?

The A3P250-1FG256T positions itself as a mid-range, automotive-qualified FPGA that combines a practical mix of logic elements, on-chip memory, and extensive I/O in a compact LBGA package. Its electrical and thermal specifications make it suitable for designers who need a qualified device for reliable, temperature-tolerant embedded and automotive applications.

This device is appropriate for teams building solutions that require moderate logic capacity, substantial peripheral connectivity, and formal qualification for automotive deployment, while maintaining a small PCB footprint and controlled power requirements.

Request a quote or submit an inquiry for availability and pricing of the A3P250-1FG256T to begin integrating this ProASIC3 FPGA into your next design.