A3P250-1FGG256T

The A3P250-1FGG256T is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology offering 6,144 logic elements, 157 I/O pins and approximately 0.037 Mbits of embedded memory. Built for applications that require moderate logic density with automotive qualification, the device combines non-volatile flash-based FPGA architecture in a 256-LBGA package for robust board-level integration.

With AEC-Q100 qualification, a broad operating range and a compact surface-mount BGA package, this device targets designs where reliability, predictable I/O count and controlled supply voltages are key design drivers.

Key Features

• Core Logic  6,144 logic elements (cells) providing a balance of programmable logic capacity and deterministic resource allocation for mid-density designs.
• Embedded Memory  Total on-chip RAM of 36,864 bits (approximately 0.037 Mbits) to support register files, FIFOs and small data buffers within the FPGA fabric.
• I/O Capacity  157 user I/O pins to connect to sensors, peripherals and system buses without external expander logic.
• Gate Equivalent  Approximately 250,000 gates for estimating integration of custom logic functions alongside system glue logic.
• Power and Supply  Specified voltage supply range of 1.425 V to 1.575 V to support stable core operation within recommended margins.
• Package and Mounting  256-LBGA supplier package (256-FPBGA, 17 × 17 mm) in a surface-mount form factor for compact PCB designs and reliable soldered connections.
• Automotive Qualification & Temperature Range  Qualified to AEC-Q100 and rated for operation from −40 °C to 125 °C for use in temperature-demanding environments.
• Regulatory Compliance  RoHS-compliant construction for adherence to environmental and manufacturing requirements.

Typical Applications

• Automotive control modules  AEC-Q100 qualification and a −40 °C to 125 °C operating range make this FPGA suitable for in-vehicle control and sensor interface functions.
• Embedded system integration  Use the device to implement glue logic, protocol bridging and custom peripheral interfaces where moderate logic capacity and on-chip RAM suffice.
• Industrial equipment  The robust temperature rating and plentiful I/O support sensor interfacing, motor control logic and local I/O aggregation in industrial designs.

Unique Advantages

• AEC-Q100 Qualified:  Provides documented automotive qualification for use in safety- and temperature-sensitive vehicle applications.
• Balanced Logic and Memory:  6,144 logic elements combined with embedded RAM enable compact implementation of mid-complexity digital functions without external memory.
• Ample I/O Count:  157 I/O pins reduce the need for external bus expanders and simplify board-level routing for multi-peripheral systems.
• Compact BGA Package:  256-LBGA (256-FPBGA, 17 × 17 mm) delivers high pin density in a surface-mount form factor suited to space-constrained PCBs.
• Wide Operating Temperature:  Rated −40 °C to 125 °C to support designs operating across harsh temperature ranges common in automotive and industrial environments.
• RoHS Compliance:  Meets environmental regulations for lead-free manufacturing and assembly processes.

Why Choose A3P250-1FGG256T?

The A3P250-1FGG256T positions itself as a reliable, mid-density FPGA option that pairs a practical logic element count and embedded memory with automotive-grade qualification and a compact BGA package. Its defined supply range, substantial I/O count and AEC-Q100 status make it appropriate for engineers designing vehicle electronics and other temperature-demanding embedded systems that require predictable, qualified components.

For teams seeking a proven FPGA building block that simplifies circuit integration while meeting stringent environmental and qualification requirements, this Microchip ProASIC3 device offers a clear, specification-driven choice supporting long-term production and system stability.

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