A3PN060-Z1VQ100I

The A3PN060-Z1VQ100I is a ProASIC3 nano flash-based FPGA from Microchip Technology, offering a compact, industrial‑grade programmable fabric in a 100‑TQFP package. The device combines on-chip logic, embedded RAM and flexible I/O to implement glue logic, custom state machines and control interfaces in space‑constrained designs.

Documented ProASIC3 nano fabric features include multiple low‑power modes and global resource architectures that help manage power and clock distribution. Key electrical and environmental parameters include a supply range of 1.425 V to 1.575 V and an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic  Approximately 1,536 logic elements (equivalent to the device's 1,536 CLBs) and 60,000 usable gates for implementing combinational and sequential designs.
• Embedded Memory  On‑chip embedded RAM totaling 18,432 bits to support register files, FIFOs and small data buffers without external memory.
• I/O Capacity  71 general‑purpose I/O pins for peripheral interfacing, sensor connections and system control signals.
• Low‑Power Fabric  ProASIC3 nano fabric includes multiple documented low‑power modes (Static/Idle, User Low Static, Sleep and Shutdown) to reduce power in idle or constrained states.
• Global Resources & Clocking  Device documentation details global resource support including VersaNet distribution and spine architecture for organized clock and signal routing across the array.
• Package & Mounting  Surface‑mount 100‑TQFP package (supplier device package listed as 100‑VQFP, 14×14) for board‑level integration in compact footprints.
• Electrical & Environmental  Nominal supply range 1.425 V to 1.575 V; industrial operating temperature −40 °C to 100 °C. RoHS compliant.

Typical Applications

• Industrial control  Industrial‑grade temperature range and flexible I/O make the device suitable for implementing control logic, interface translation and small automation tasks.
• Embedded glue logic  Use the 1,536 logic elements and 60,000 gates to consolidate discrete logic, timing, and sequencing functions into a single programmable device.
• Low‑power systems  Leverage documented low‑power modes (Sleep, Shutdown, Static) to reduce energy use in battery‑sensitive or power‑managed designs.
• Compact board designs  The 100‑TQFP surface‑mount package supports dense PCB layouts where board area and package footprint are constrained.

Unique Advantages

• Flash‑based FPGA fabric: The ProASIC3 nano architecture provides non‑volatile configuration storage and documented low‑power modes for predictable power profiles.
• Right‑sized logic and memory: 1,536 logic elements and 18,432 bits of embedded RAM enable efficient implementation of control, glue and buffering functions without external memory.
• Flexible I/O count: 71 I/O pins provide connectivity options for sensors, actuators and peripheral buses while minimizing need for external expanders.
• Industrial reliability: Specified operating range from −40 °C to 100 °C supports deployment in temperature‑challenging environments.
• Compact package: 100‑TQFP / 100‑VQFP (14×14) options facilitate integration into space‑limited PCBs using standard surface‑mount assembly.
• Documented global resources: Series user documentation describes VersaNet distribution, spine architecture and global resource support to aid predictable clocking and routing in designs.

Why Choose A3PN060-Z1VQ100I?

The A3PN060-Z1VQ100I positions itself as a compact, industrial‑rated programmable building block for embedded designs that require modest logic density, on‑chip RAM and a robust set of I/O in a small package. Its flash‑based ProASIC3 nano fabric and documented low‑power features make it suitable for designs that need persistent configuration, controlled power management and predictable resource distribution.

This device suits engineers and procurement teams building industrial control modules, compact embedded controllers and low‑power interface logic where temperature range, supply constraints and board area are key considerations. The combination of documented architecture, logic resources and package options supports straightforward integration into production designs.

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