A3PN125-VQ100I
| Part Description |
ProASIC3 nano Field Programmable Gate Array (FPGA) IC 71 36864 100-TQFP |
|---|---|
| Quantity | 937 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-VQFP (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-TQFP | Number of I/O | 71 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3072 | Number of Logic Elements/Cells | 3072 | ||
| Number of Gates | 125000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of A3PN125-VQ100I – ProASIC3 nano FPGA, 100-TQFP
The A3PN125-VQ100I is a ProASIC3 nano field programmable gate array (FPGA) IC from Microchip Technology delivered in a 100-TQFP package. It provides a compact, industrial-grade programmable logic solution with 3,072 logic elements and on-chip RAM for embedded control and interface functions.
With 71 user I/Os, a supply voltage range of 1.425 V to 1.575 V, and an operating temperature range of −40 °C to 100 °C, the device is targeted at designs that require industrial temperature capability and a moderate logic density in a surface-mount TQFP footprint.
Key Features
- Core Logic 3,072 logic elements providing 125,000 equivalent gates for implementing combinational and sequential logic.
- Embedded Memory 36,864 bits of total on-chip RAM to support buffering, small lookup tables, and state storage.
- I/O Count 71 user I/O pins suitable for interfacing with peripherals, sensors, and external logic devices.
- Power Nominal supply voltage range from 1.425 V to 1.575 V for core power delivery and predictable logic levels.
- Package & Mounting 100-TQFP (100-VQFP, 14×14 mm) surface-mount package for compact board-level integration.
- Temperature & Grade Industrial-grade device with an operating temperature range of −40 °C to 100 °C for use in elevated and extended-temperature environments.
- Compliance RoHS-compliant construction to meet common environmental and manufacturing requirements.
Typical Applications
- Industrial Control — Implement control logic, I/O aggregation, and glue functions in industrial systems that require an extended temperature range.
- Embedded Logic and Interfaces — Provide programmable glue logic and protocol interfacing using 3,072 logic elements and 71 I/Os for compact embedded designs.
- Prototyping and Low- to Mid-density FPGA Designs — Rapidly validate and deploy moderate-complexity logic implementations within a surface-mount TQFP package.
Unique Advantages
- Moderate Logic Density — 3,072 logic elements and 125,000 gates provide a balance between capacity and board-level simplicity for mid-range designs.
- On-chip RAM Availability — 36,864 bits of embedded RAM reduce dependence on external memory for small buffers and state storage.
- Industrial Temperature Support — Rated from −40 °C to 100 °C to meet environmental demands in industrial deployments.
- Compact Surface-mount Package — 100-TQFP (14×14 mm) enables integration into space-constrained PCBs while providing ample I/O.
- Low-voltage Core Operation — 1.425 V to 1.575 V supply enables predictable power planning for designs targeting compatible power rails.
- RoHS Compliant — Conforms to common environmental requirements for manufacturing and deployment.
Why Choose A3PN125-VQ100I?
The A3PN125-VQ100I is positioned as a practical, industrial-grade FPGA option for designers who need moderate programmable logic capacity, meaningful on-chip memory, and a generous I/O count in a compact TQFP package. Its temperature rating and surface-mount package make it suitable for embedded systems and industrial control applications where board space and environmental resilience matter.
Manufactured by Microchip Technology, this ProASIC3 nano device provides a predictable, integrated building block for mid-density designs that benefit from on-chip RAM and extensive I/O while maintaining RoHS compliance.
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Date Founded: 1989
Headquarters: Chandler, Arizona, USA
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