A3PN125-Z1VQ100

IC FPGA 71 I/O 100VQFP
Part Description

ProASIC3 nano Field Programmable Gate Array (FPGA) IC 71 36864 100-TQFP

Quantity 1,713 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package100-VQFP (14x14)GradeCommercialOperating Temperature-20°C – 85°C
Package / Case100-TQFPNumber of I/O71Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3072Number of Logic Elements/Cells3072
Number of Gates125000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of A3PN125-Z1VQ100 – ProASIC3 nano FPGA, 71 I/O, 3,072 logic elements

The A3PN125-Z1VQ100 is a ProASIC3 nano field programmable gate array (FPGA) offered in a 100-TQFP surface-mount package. It provides 3,072 logic elements (3072 logic element cells) and approximately 36,864 bits of on-chip RAM to implement custom logic, glue logic and embedded control functions in commercial electronic designs.

Designed for compact, low-power commercial applications, this device combines a moderate gate count (125,000 gates) and a 71-pin I/O complement with a narrow operating voltage range and defined low-power modes documented in the ProASIC3 nano user guide.

Key Features

  • Core Logic — 3,072 logic elements (3072 logic element cells) supporting up to 125,000 gates for implementing programmable logic functions.
  • Embedded Memory — 36,864 bits of on-chip RAM for state storage, FIFOs, and small data buffers.
  • I/O — 71 user I/O pins to support multiple peripheral interfaces and board-level signal routing.
  • Power — Operates from a defined supply range of 1.425 V to 1.575 V for predictable power planning and supply design.
  • Low-Power Modes — The ProASIC3 nano family documentation includes dedicated low-power operating modes (static, sleep and shutdown) to help minimize device power when portions of the design are idle.
  • Package & Mounting — Supplied in a 100-TQFP surface-mount package (supplier device package: 100-VQFP, 14 × 14 mm) for compact PCB integration.
  • Temperature & Grade — Commercial grade device rated for operation from −20 °C to 85 °C.
  • Environmental Compliance — RoHS-compliant component.

Typical Applications

  • Embedded control and glue logic — The combination of 3,072 logic elements and 71 I/Os fits medium-complexity control functions and board-level interface consolidation in commercial products.
  • Interface bridging — Use the available I/O count and on-chip RAM to implement protocol translation or buffering in space-constrained designs.
  • Compact consumer electronics — The 100-TQFP surface-mount package and commercial temperature rating support integration into consumer and commercial electronics where board space and cost are considerations.

Unique Advantages

  • Right-sized logic density: 3,072 logic elements and 125,000 gates provide a balance of capacity for mid-tier programmable tasks without the footprint or cost of larger FPGAs.
  • Embedded RAM for on-chip buffering: 36,864 bits of on-chip RAM enable local data storage and reduce external memory requirements for small FIFOs and state machines.
  • Meaningful I/O count: 71 I/Os simplify board-level design by accommodating multiple signals and interfaces directly on-chip.
  • Predictable power envelope: Narrow supply range (1.425 V–1.575 V) and documented low-power modes support consistent power-system design and power-saving strategies.
  • Compact, surface-mount package: The 100-TQFP (14 × 14 mm) footprint helps minimize PCB area while keeping assembly compatible with standard surface-mount processes.
  • RoHS compliant: Meets environmental compliance requirements for commercial product builds.

Why Choose A3PN125-Z1VQ100?

The A3PN125-Z1VQ100 positions itself as a practical, mid-density programmable logic device for commercial applications that require moderate gate capacity, a useful complement of I/O, and on-chip RAM in a compact package. Its defined supply range, commercial temperature rating, and documented low-power operating modes make it suitable for engineers designing cost- and space-conscious embedded systems.

Choose this ProASIC3 nano device when you need an FPGA that blends programmable logic density, integrated RAM, and a compact 100-TQFP surface-mount package to simplify board-level integration while keeping BOM and footprint under control.

Request a quote or submit an RFQ to get pricing and availability for A3PN125-Z1VQ100.

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