A3PN125-Z1VQG100I

The A3PN125-Z1VQG100I is a ProASIC3 nano FPGA from Microchip Technology, offering a compact, mid-density programmable logic solution. It integrates approximately 3,072 logic elements (3072 logic elements), roughly 125,000 gates of combinational logic capacity, and on-chip memory to support embedded logic and buffering.

Designed with industrial-grade robustness, the device provides 71 user I/Os, a narrow core supply range of 1.425 V to 1.575 V, and an operating temperature span of -40°C to 100°C. The ProASIC3 nano family documentation highlights low-power modes and global resource features such as VersaNet global network distribution and spine architecture, enabling efficient system-level clocking and resource sharing.

Key Features

• Core Logic — Approximately 3,072 logic elements and 125,000 gates to implement combinational and sequential logic functions.
• Embedded Memory — Approximately 36,864 bits of on-chip RAM for small buffers, state storage, and local data paths.
• I/O — 71 programmable I/Os for interfacing with peripherals, sensors, and other digital subsystems.
• Power and Voltage — Core supply range of 1.425 V to 1.575 V; device documentation includes coverage of low-power modes to help manage static and dynamic power.
• Architecture & Global Resources — Device family documentation addresses global resource support, including VersaNet global network distribution, spine architecture, and clock aggregation for system-level integration.
• Package & Mounting — Supplied in a 100-pin TQFP package (supplier device package listed as 100-VQFP, 14 × 14 mm); surface-mount mounting for PCB assembly.
• Industrial Grade and Temperature Range — Rated as Industrial with an operating temperature range of -40°C to 100°C for demanding environments.
• Compliance — RoHS compliant for lead-free manufacturing processes.

Typical Applications

• Industrial Control — Implement control logic, finite-state machines, and I/O aggregation in systems that require industrial temperature operation and reliable on-board logic capacity.
• Embedded Interface & Glue Logic — Bridge peripherals and consolidate interface logic using the device’s 71 I/Os and integrated logic elements.
• Low-Power Embedded Systems — Use documented low-power modes and the device’s narrow supply range to optimize power consumption in energy-conscious designs.
• OEM Logic Integration — Integrate custom algorithmic or timing-critical functions on-chip to reduce component count and simplify PCB routing.

Unique Advantages

• Right-sized logic capacity: Approximately 3,072 logic elements and 125,000 gates provide a clear balance between integration and cost for mid-density designs.
• On-chip memory for local buffering: About 36,864 bits of embedded RAM reduce dependence on external memory for small data-storage needs.
• Deterministic I/O resources: 71 user I/Os enable predictable interfacing and simplify peripheral connectivity planning.
• Industrial-ready operation: Rated for -40°C to 100°C, supporting deployments in temperature-extreme environments.
• Power and system-level resource support: Narrow core voltage range and documented low-power modes help designers manage power budgets; architecture topics such as global resource distribution and clock aggregation aid system integration.
• Manufacturability and compliance: Surface-mount 100-pin TQFP package and RoHS compliance support standard assembly flows and regulatory requirements.

Why Choose A3PN125-Z1VQG100I?

The A3PN125-Z1VQG100I positions itself as a practical, industrial-grade ProASIC3 nano FPGA option for engineers seeking a compact programmable logic device with a clear balance of logic resources, on-chip memory, and I/O count. Its documented architecture and global resource topics—combined with low-power mode support—make it suitable for embedded control, interface consolidation, and OEM logic integration where predictable thermal and power behavior matter.

Backed by Microchip Technology’s ProASIC3 nano documentation and a RoHS-compliant manufacturing profile, this device is targeted at teams that need reliable, mid-density FPGA capability in a surface-mount 100-TQFP footprint with industrial temperature support.

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