A3PN125-Z1VQ100I
| Part Description |
ProASIC3 nano Field Programmable Gate Array (FPGA) IC 71 36864 100-TQFP |
|---|---|
| Quantity | 1,139 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-VQFP (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-TQFP | Number of I/O | 71 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3072 | Number of Logic Elements/Cells | 3072 | ||
| Number of Gates | 125000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of A3PN125-Z1VQ100I – ProASIC3 nano Field Programmable Gate Array (FPGA) IC 71 36864 100-TQFP
The A3PN125-Z1VQ100I is a ProASIC3 nano flash-based FPGA from Microchip Technology. It integrates a flash-configurable FPGA fabric with 3,072 logic elements and approximately 36.9 kbits (36,864 bits) of on-chip RAM, delivering a compact, industrial-grade programmable logic option.
With 71 I/Os, a 100-TQFP surface-mount package, and an operating range of -40 °C to 100 °C, this device targets industrial and space-constrained designs that require moderate logic density, embedded memory, and low-voltage operation.
Key Features
- Core Logic 3,072 logic elements (cells) providing a logic capacity of 125,000 gates for implementing custom digital functions.
- Embedded Memory 36,864 bits of on-chip RAM (approximately 36.9 kbits) for local buffering, state storage, and small data structures.
- I/O Density 71 programmable I/O pins to interface with peripherals and system signals on compact boards.
- Power and Voltage Narrow supply range of 1.425 V to 1.575 V to match low-voltage system rails; device family documentation describes multiple low-power modes (Static, Sleep, Shutdown).
- Package & Mounting Surface-mount 100-TQFP package; supplier device package listed as 100-VQFP (14×14) for board-level integration.
- Industrial Temperature Rated for operation from -40 °C to 100 °C, suitable for industrial environments.
- Flash-Based FPGA Fabric Part of the ProASIC3 nano family and documented in the ProASIC3 nano FPGA Fabric User’s Guide, including information on low-power modes and global resource architectures.
- Compliance RoHS compliant for environmental requirements.
Typical Applications
- Industrial Control Deploy programmable logic in industrial systems that require an extended temperature range and robust board-level packaging.
- Low-Power Embedded Systems Use the device’s flash-based fabric and documented low-power modes for designs where standby and idle power matter.
- Compact Board-Level Solutions Integrate programmable logic and moderate I/O count in space-constrained designs using the 100-TQFP footprint.
Unique Advantages
- Industrial-rated operation: -40 °C to 100 °C specification supports deployment in harsh environments without additional temperature qualification text.
- Balanced logic and memory: 3,072 logic elements combined with 36,864 bits of on-chip RAM provides practical on-chip resources for buffering and control logic.
- Compact integration: 71 I/Os in a 100-TQFP surface-mount package simplifies board layout for compact systems.
- Low-voltage compatibility: 1.425 V to 1.575 V supply range aligns with low-voltage digital domains.
- Documented low-power modes and global resources: Series documentation describes Static, Sleep, and Shutdown modes plus global resource architectures for clock and network distribution.
- RoHS compliant: Meets common environmental compliance requirements for lead-free manufacturing.
Why Choose A3PN125-Z1VQ100I?
The A3PN125-Z1VQ100I positions a flash-based ProASIC3 nano FPGA fabric into an industrial-grade, compact package that balances logic capacity, embedded RAM, and I/O for moderate-complexity designs. Its documented low-power modes and global resource architecture support efficient power management and predictable clock/network distribution at the system level.
This device is suited to engineers and procurement teams specifying programmable logic for industrial or board-level applications that require defined logic density, on-chip memory, and a 100-TQFP surface-mount footprint, all backed by Microchip Technology documentation for the ProASIC3 nano family.
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