A3PN250-2VQ100I

The A3PN250-2VQ100I is a ProASIC3 nano Field Programmable Gate Array (FPGA) IC from Microchip Technology provided in a 100‑TQFP surface‑mount package. It delivers 6,144 logic elements with approximately 0.037 Mbits of embedded memory and 250,000 gates in a compact footprint.

Targeted for industrial applications, this FPGA offers 68 I/O pins, a 1.425 V to 1.575 V supply range and an operating temperature range of −40 °C to 100 °C, making it suitable for designs that require moderate logic density, controlled power rails, and industrial temperature capability.

Key Features

• Core / Logic  6,144 logic elements providing a balanced mix of configurable resources for custom digital designs and glue logic.
• Gates  Approximately 250,000 gates to support medium-complexity logic implementations.
• Embedded Memory  Approximately 0.037 Mbits of on-chip RAM for small buffering, state storage, and control logic.
• I/O  68 general-purpose I/O pins for interfacing with external peripherals, sensors, and control signals.
• Power  Specified core supply range of 1.425 V to 1.575 V to support stable power management and supply planning.
• Package & Mounting  100‑TQFP (surface mount) package—supplier package listed as 100‑VQFP (14×14)—for compact, board‑level integration.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for use in temperature‑sensitive environments.
• Compliance  RoHS compliant, meeting common environmental and manufacturing requirements.

Typical Applications

• Industrial automation and control  Use the industrial temperature rating and 68 I/O pins to implement control logic, I/O aggregation, and timing-critical tasks in industrial equipment.
• Sensor interfacing and data conditioning  Leverage the available I/O and embedded memory for collecting, buffering, and pre-processing sensor data at the edge.
• Custom glue logic and protocol bridging  Deploy the device as configurable glue logic between subsystems, using the logic elements and gate capacity to implement custom protocol translation and control paths.
• Compact embedded systems  The 100‑TQFP surface‑mount package and moderate logic density suit space‑constrained boards that require on‑chip configurability.

Unique Advantages

• Balanced logic density: 6,144 logic elements and 250,000 gates provide sufficient resources for medium complexity designs without excessive board area.
• Compact packaging: 100‑TQFP surface‑mount package enables integration into space‑limited PCBs while maintaining robust I/O count.
• Industrial temperature capability: Rated from −40 °C to 100 °C to support deployment in industrial environments.
• Defined power envelope: Narrow core supply range (1.425 V to 1.575 V) simplifies power‑supply selection and regulation design.
• On‑chip memory: Approximately 0.037 Mbits of embedded RAM for local buffering and state machine storage, reducing external memory dependency.
• RoHS compliant: Conforms to RoHS requirements for environmentally conscious manufacturing.

Why Choose A3PN250-2VQ100I?

The A3PN250-2VQ100I positions itself as a practical, industrial‑grade FPGA option for engineers seeking moderate logic capacity, a healthy I/O count, and compact, surface‑mount packaging. Its combination of 6,144 logic elements, 250,000 gates, embedded memory, and a defined supply voltage range makes it suitable for designs that balance capability with board‑space and power considerations.

Manufactured by Microchip Technology and offered in a 100‑TQFP package with RoHS compliance, this device is aimed at teams developing industrial control, I/O aggregation, and custom logic solutions that require predictable thermal and electrical characteristics.

Request a quote or contact sales to discuss availability, lead times, and pricing for the A3PN250-2VQ100I.