A3PN250-2VQG100

The A3PN250-2VQG100 is a ProASIC3 nano field programmable gate array (FPGA) offered in a 100‑lead thin quad flat package (100‑TQFP) for surface‑mount assembly. It provides a compact, commercial‑grade programmable logic solution combining 250,000 logic gates, 6,144 logic elements and 36,864 total RAM bits for application flexibility across communications, instrumentation and embedded systems.

Designed for designs that require moderate gate density, multiple I/O and low‑voltage operation, the device supports a 1.425 V to 1.575 V core supply and operates over a commercial temperature range of −20 °C to 85 °C, while meeting RoHS compliance requirements.

Key Features

• Core Capacity 250,000 gates and 6,144 logic elements provide a substantial resource pool for implementing custom logic, state machines and protocol handling.
• On‑chip Memory 36,864 total RAM bits (approximately 36.9 kbits) for buffering, FIFOs and small data tables directly on the FPGA fabric.
• I/O Resources 68 general‑purpose I/O pins to support parallel interfaces, GPIO arrays and mixed signal routing to external peripherals.
• Power and Voltage Core supply range of 1.425 V to 1.575 V for compatibility with low‑voltage system domains.
• Package & Mounting 100‑TQFP (100‑VQFP, 14 × 14 mm footprint) in a surface‑mount package for compact board designs and automated assembly.
• Operating Range & Compliance Commercial operating temperature of −20 °C to 85 °C and RoHS‑compliant status for regulatory and environmental considerations.

Typical Applications

• Communications Equipment Protocol bridging, data packet handling and custom I/O interfacing where moderate logic density and dedicated RAM are required.
• Instrumentation & Test Control logic, timing generation and on‑board data buffering for benchtop instruments and automated test gear.
• Embedded Control Systems User interface control, sensor interfacing and peripheral aggregation in compact commercial electronic products.
• IoT & Edge Devices Local preprocessing, simple packet processing and glue logic in small form‑factor, low‑voltage designs.

Unique Advantages

• Balanced Logic and Memory Mix: Combines 6,144 logic elements with approximately 36.9 kbits of on‑chip RAM to support stateful functions and buffering without external memory.
• Generous I/O Count: 68 I/O pins simplify system-level integration, reducing the need for external I/O expanders.
• Compact Surface‑Mount Package: 100‑TQFP (14 × 14 mm) enables dense PCB layouts and automated assembly for cost‑sensitive production runs.
• Low‑Voltage Core: Narrow core supply range (1.425 V–1.575 V) aligns with modern low‑voltage power rails for simplified power supply design.
• Commercial Temperature Rating: Operates from −20 °C to 85 °C to match typical commercial electronic product requirements.
• RoHS Compliant: Conforms to lead‑free environmental standards for global manufacturing and shipment.

Why Choose A3PN250-2VQG100?

The A3PN250-2VQG100 delivers a practical combination of logic capacity, on‑chip RAM and I/O in a compact 100‑TQFP surface‑mount package, making it well suited to commercial embedded designs that need programmable logic without large form factors or external memory. Its defined supply range and commercial temperature rating make it straightforward to integrate into low‑voltage systems.

This part is a fit for designers who need a reliable, RoHS‑compliant programmable device with a clear resource profile—6,144 logic elements, 250,000 gates, 36,864 RAM bits and 68 I/O—backed by documentation and vendor support for deployment in communications, instrumentation, embedded control and IoT applications.

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