A3PN250-2VQG100I
| Part Description |
ProASIC3 nano Field Programmable Gate Array (FPGA) IC 68 36864 100-TQFP |
|---|---|
| Quantity | 1,635 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-VQFP (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-TQFP | Number of I/O | 68 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6144 | Number of Logic Elements/Cells | 6144 | ||
| Number of Gates | 250000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of A3PN250-2VQG100I – ProASIC3 nano FPGA, 68 I/Os, 100-TQFP
The A3PN250-2VQG100I is a ProASIC3 nano field programmable gate array (FPGA) from Microchip Technology. It provides up to 6,144 logic elements and 36,864 bits of on‑chip RAM in a compact 100‑pin TQFP surface‑mount package.
Designed for industrial applications, this device combines a moderate logic capacity with 68 I/O pins and a tight supply voltage window, offering a compact, specification-driven option for board‑level programmable logic implementations that require industrial temperature operation.
Key Features
- Core Logic 6,144 logic elements (cells) supporting up to 250,000 gates for mid‑complexity digital designs.
- On‑Chip Memory 36,864 bits of embedded RAM (approximately 0.037 Mbits) for local buffering and state storage.
- I/O Capacity 68 general‑purpose I/O pins to interface with peripherals and system buses.
- Supply Voltage Narrow operating supply range of 1.425 V to 1.575 V for precise power‑domain integration.
- Package and Mounting 100‑pin TQFP surface‑mount package; supplier device package listed as 100‑VQFP (14×14 mm) for board‑level assembly.
- Industrial Temperature Range Rated for operation from ‑40°C to 100°C to meet demanding environmental requirements.
- Regulatory Compliance RoHS compliant, supporting lead‑free manufacturing processes.
Typical Applications
- Industrial control and automation Use the device’s industrial temperature rating, 68 I/Os, and 6,144 logic elements for control logic, sensor aggregation, and machine‑level interfaces.
- Board‑level programmable logic A compact 100‑pin TQFP surface‑mount package (14×14 mm) makes the device suitable for space‑constrained embedded PCBs requiring onboard programmable functionality.
- Embedded glue logic and peripheral interfacing Combine available I/Os and on‑chip memory to implement protocol adaptation, signal conditioning, and timing logic between system blocks.
Unique Advantages
- Mid‑range logic capacity: 6,144 logic elements provide a balance of resources for moderate complexity designs without the overhead of larger FPGAs.
- Integrated on‑chip RAM: 36,864 bits of RAM enable local buffering and state retention for control and processing tasks.
- Industrial temperature qualification: Rated from ‑40°C to 100°C to support deployments in elevated or variable temperature environments.
- Compact, board‑friendly packaging: 100‑pin TQFP / 100‑VQFP (14×14) surface‑mount package simplifies placement on space‑constrained PCBs.
- Precise supply window: 1.425–1.575 V supply requirement allows predictable power integration in tightly controlled designs.
- RoHS compliant: Supports lead‑free manufacturing and environmental compliance requirements.
Why Choose A3PN250-2VQG100I?
The A3PN250-2VQG100I positions itself as a practical, industrial‑rated programmable logic device for engineers who need a compact FPGA with a defined set of resources: 6,144 logic elements, 68 I/Os, and 36,864 bits of embedded RAM. Its 100‑pin surface‑mount package and narrow supply voltage make it suitable for tightly integrated board designs where predictable electrical and thermal behavior is required.
This device is appropriate for development and production scenarios that require mid‑level logic capacity, on‑chip memory for buffering, and operation across an industrial temperature range, all within a RoHS‑compliant, board‑level package from Microchip Technology.
Request a quote or contact sales to discuss pricing, availability, and how the A3PN250-2VQG100I can fit into your next industrial or embedded design project.

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