A3PN250-ZVQ100

IC FPGA 68 I/O 100VQFP
Part Description

ProASIC3 nano Field Programmable Gate Array (FPGA) IC 68 36864 100-TQFP

Quantity 134 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-VQFP (14x14)GradeCommercialOperating Temperature-20°C – 85°C
Package / Case100-TQFPNumber of I/O68Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6144Number of Logic Elements/Cells6144
Number of Gates250000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of A3PN250-ZVQ100 – ProASIC3 nano Field Programmable Gate Array (FPGA) IC 68 36864 100-TQFP

The A3PN250-ZVQ100 is a ProASIC3 nano flash-based FPGA from Microchip Technology. It provides a compact, low-power programmable logic fabric with 6,144 logic elements, on-chip embedded memory, and 68 general-purpose I/Os in a 100-pin TQFP package.

Designed for commercial-grade embedded designs, the device combines a flash-configured FPGA fabric with multiple low-power modes and global resource support to address applications that require small form factor programmable logic, deterministic configuration and low static power.

Key Features

  • Logic Capacity  Approximately 6,144 logic elements (6144 logic elements) suitable for compact programmable-logic implementations.
  • Embedded Memory  Total on-chip RAM: 36,864 bits (approx. 36.9 kbits) of embedded memory for state, buffering and small data structures.
  • I/O  68 general-purpose I/Os enabling multiple peripheral and bus connections directly to the FPGA fabric.
  • Gate Density  Equivalent to 250,000 gates of logic capacity for combining glue logic and small-scale acceleration functions.
  • Low-Power Flash Architecture  Flash-based configuration with documented low-power operation modes including Static (Idle), User Low Static, Sleep and Shutdown to help manage static and dynamic power.
  • Global Resources & Clocking  Architecture-level features described in the device family documentation include global resource distribution, VersaNet global network distribution, spine architecture and clock aggregation support for system-level routing and clocking strategies.
  • Voltage & Power  Single-core supply range specified at 1.425 V to 1.575 V for the FPGA core.
  • Package & Mounting  100-TQFP (100-VQFP, 14×14) surface-mount package for compact PCB designs.
  • Operating Range  Commercial grade with an operating temperature range of −20 °C to 85 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • Embedded Control Logic  Use the programmable fabric and on-chip RAM to implement custom control, sequencing and glue logic functions in compact embedded systems.
  • Interface Consolidation  Leverage 68 I/Os and the device’s global routing resources to consolidate multiple peripheral interfaces into a single programmable device.
  • Low-Power Designs  Employ the device’s low-power modes and flash-based configuration for battery-aware or always-on applications that benefit from reduced static power.

Unique Advantages

  • Flash-Based Nonvolatile Configuration:  Flash configuration enables immediate, nonvolatile FPGA behavior at power-up without external configuration memory.
  • Small, PCB-Friendly Package:  100-TQFP surface-mount package allows integration into space-constrained PCBs while providing a full complement of I/Os.
  • Explicit Low-Power Modes:  Documented Static, User Low Static, Sleep and Shutdown modes give designers defined options to reduce power consumption during idle or low-activity periods.
  • Balanced Logic and Memory:  Combination of ~6,144 logic elements and ~36.9 kbits of on-chip RAM supports control-oriented and buffering tasks without external memory for many applications.
  • System-Level Routing Features:  Global resource distribution, VersaNet and clock aggregation capabilities described in the device documentation help with deterministic routing and clocking in multi-domain designs.
  • Commercial-Grade Temperature Range:  Specified −20 °C to 85 °C operating range for general-purpose commercial applications.

Why Choose A3PN250-ZVQ100?

The A3PN250-ZVQ100 is positioned for designers who need a compact, flash-configured FPGA with clearly defined low-power modes, a moderate logic and memory footprint, and a high I/O count in a 100-pin TQFP package. Its combination of ~6,144 logic elements, 36,864 bits of embedded RAM, and architecture-level global routing features make it suitable for embedded control, interface consolidation and other space-constrained programmable logic tasks in commercial products.

Choosing this device provides a balance of integration, predictable nonvolatile configuration and power management options, backed by Microchip Technology’s ProASIC3 nano FPGA documentation and family resources for system-level integration and clocking strategies.

Request a quote or submit a product inquiry to evaluate the A3PN250-ZVQ100 for your next design. Our team can provide pricing, availability and support information to help you move from prototype to production.

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