A3PN250-ZVQ100I
| Part Description |
ProASIC3 nano Field Programmable Gate Array (FPGA) IC 68 36864 100-TQFP |
|---|---|
| Quantity | 268 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-VQFP (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-TQFP | Number of I/O | 68 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6144 | Number of Logic Elements/Cells | 6144 | ||
| Number of Gates | 250000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of A3PN250-ZVQ100I – ProASIC3 nano Field Programmable Gate Array (FPGA) IC 68 36864 100-TQFP
The A3PN250-ZVQ100I is a ProASIC3 nano flash-based FPGA fabric from Microchip Technology, offering a medium-density programmable logic solution with embedded RAM and multiple low-power operating modes. It targets designs that require deterministic logic capacity, on-chip memory, and industrial temperature operation.
Key value propositions include a flash-based FPGA architecture with documented low-power modes, 6,144 logic elements, 68 general-purpose I/Os, and a compact 100-pin TQFP surface-mount package suitable for industrial applications.
Key Features
- FPGA Core ProASIC3 nano flash-based fabric with a device capacity of 250,000 gates and 6,144 logic elements for medium-density logic implementation.
- Embedded Memory 36,864 bits of on-chip RAM (approximately 0.0369 Mbits) for local data buffering and state storage.
- I/O 68 user I/Os to support a variety of external interfaces and system-level signaling.
- Power Supply Core voltage supply range of 1.425 V to 1.575 V, enabling precise power sequencing and system integration.
- Low-Power Modes Supports multiple low-power modes (including static/idle, user low static, sleep, and shutdown) as documented in the ProASIC3 nano FPGA Fabric User’s Guide.
- Package & Mounting 100-pin TQFP package; supplier device package listed as 100-VQFP (14×14). Surface-mount mounting type for PCB assembly.
- Temperature & Grade Industrial grade device rated for operation from −40 °C to 100 °C.
- Environmental Compliance RoHS compliant.
- Documentation Comprehensive ProASIC3 nano FPGA Fabric User’s Guide covers architecture, low-power modes, global resources, and programming considerations.
Unique Advantages
- Deterministic logic capacity: 6,144 logic elements and 250,000 gates provide a clearly defined resource envelope for mid-density designs.
- On-chip memory available: 36,864 bits of embedded RAM enable local buffering and state retention without external memory.
- Designed for low-power operation: Multiple documented low-power modes support controlled power states and system power management strategies.
- Industrial temperature rating: −40 °C to 100 °C capability supports deployment in demanding environments.
- Compact surface-mount package: 100-pin TQFP (supplier 100-VQFP 14×14) balances I/O count and board-space efficiency for space-constrained designs.
- Regulatory cleanliness: RoHS compliance simplifies adoption in supply chains requiring lead-free components.
Why Choose A3PN250-ZVQ100I?
The A3PN250-ZVQ100I combines a flash-based ProASIC3 nano FPGA fabric with defined logic resources (6,144 logic elements, 250,000 gates), embedded RAM, and 68 I/Os—making it suitable for mid-density programmable logic tasks where on-chip memory and controlled power states are required. Its industrial temperature rating and surface-mount 100-pin package support deployment in industrial and temperature-challenging environments.
Comprehensive documentation for the ProASIC3 nano fabric and explicit low-power mode descriptions help engineers design predictable power behavior and integrate the device into larger systems with clarity on architecture and global resources.
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