A54SX16P-1TQG176
| Part Description |
SX Field Programmable Gate Array (FPGA) IC 147 176-LQFP |
|---|---|
| Quantity | 1,040 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 176-TQFP (24x24) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 176-LQFP | Number of I/O | 147 | Voltage | 3 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1452 | Number of Logic Elements/Cells | 1452 | ||
| Number of Gates | 24000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of A54SX16P-1TQG176 – SX Field Programmable Gate Array (FPGA) IC 147 176-LQFP
The A54SX16P-1TQG176 is a nonvolatile SX-A family FPGA offered by Microchip Technology in a 176-pin thin quad flat pack (176-LQFP / 176-TQFP) surface-mount package. It provides 24,000 system gates and 1,452 logic elements, together with up to 147 user I/Os for mid-density, reprogrammable digital logic integration.
Designed for commercial-temperature embedded applications, this device targets designs requiring mixed-voltage I/O compatibility, nonvolatile configuration, and deterministic timing. Its combination of logic capacity, I/O flexibility and single-chip nonvolatile operation supports system-level consolidation and reliable start-up behavior.
Key Features
- Logic Capacity — 24,000 system gates and 1,452 logic elements provide mid-level implementation density for glue logic, protocol bridging and control functions.
- User I/O — 147 user-programmable I/O pins suitable for a wide range of external interfaces and board-level connections.
- Nonvolatile Single-Chip Architecture — SX-A family nonvolatile configuration (single-chip solution) enables instant-on behavior without external configuration memory.
- Mixed-Voltage I/O Support — Configurable I/O support for multiple voltage standards and 5 V input tolerance per family specifications; supports 2.5 V, 3.3 V and 5 V operation in mixed-voltage systems.
- Performance (SX-A family) — Family-level performance targets include up to 250 MHz system performance and up to 350 MHz internal performance.
- Power and I/O Robustness — Hot-swap compliant I/Os and power-up/power-down friendly operation (no sequencing required for supply voltages) simplify system power design and serviceability.
- Package and Mounting — 176-LQFP thin TQFP package (24 × 24 mm) for surface-mount PCB assembly; RoHS compliant.
- Commercial Temperature Grade — Rated for 0 °C to +70 °C operation suitable for commercial applications.
- Security and Test — SX-A family features include boundary-scan (IEEE 1149.1) and Actel Secure Programming Technology (FuseLock™) for design protection and in-system verification.
Typical Applications
- PCI and Bus Interface Logic — Family-level PCI compatibility and mixed-voltage I/O make the device suitable for implementing PCI or legacy bus interface glue logic and controllers.
- Embedded Control and Glue Logic — Use for board-level control, protocol bridging and glue logic where reprogrammability and nonvolatile configuration are required.
- In-System Diagnostics and Verification — Built-in boundary-scan and in-system diagnostic capabilities support production test and field verification workflows.
Unique Advantages
- Nonvolatile, single-chip solution: Eliminates the need for external configuration memory and simplifies system boot-up and supply sequencing.
- Flexible mixed-voltage I/O: Configurable I/O supporting 2.5 V, 3.3 V and 5 V operation with 5 V input tolerance enables direct interfacing to a broad range of legacy and modern logic levels.
- Robust I/O and power behavior: Hot-swap compliant I/Os and power-up/down friendly design reduce system-level constraints during board service and power sequencing.
- Traceable test and security features: Boundary-scan support and FuseLock programming provide production testability and protection against reverse engineering.
- Compact surface-mount package: 176-pin TQFP offers a balance of I/O count and board-space efficiency for mid-density designs.
Why Choose A54SX16P-1TQG176?
The A54SX16P-1TQG176 positions itself as a mid-density, nonvolatile FPGA option for commercial embedded designs that require reliable start-up behavior, mixed-voltage I/O flexibility and hardware-level testability. With 24,000 system gates, 1,452 logic elements and 147 user I/Os in a 176-pin thin QFP package, it fits applications that need board-level integration of control, protocol bridging and interface logic without external configuration devices.
Choosing this device provides designers with a compact, reprogrammable building block backed by SX-A family features such as hot-swap I/Os, configurable I/O standards and on-chip security/test capabilities—delivering a practical combination of performance, integration and operational robustness for commercial-temperature systems.
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