A54SX32-1BGG329
| Part Description |
SX Field Programmable Gate Array (FPGA) IC 249 329-BBGA |
|---|---|
| Quantity | 978 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 329-PBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 329-BBGA | Number of I/O | 249 | Voltage | 3 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2880 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 48000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of A54SX32-1BGG329 – SX Field Programmable Gate Array (FPGA) IC 249 329-BBGA
The A54SX32-1BGG329 is a member of the SX-A family of nonvolatile, single-chip FPGAs from Microchip Technology. It offers a mid-range logic capacity and abundant I/O in a compact 329-ball BGA package, suited for embedded designs requiring reprogrammable logic, configurable I/O and secure in-system programming.
Key Features
- Core Performance Family-level performance up to 250 MHz system performance and up to 350 MHz internal performance as documented for the SX-A family.
- Logic Capacity Approximately 48,000 system gates and 2,880 logic elements, providing substantial programmable logic for mid-complexity designs.
- I/O and Interfacing 249 user I/O pins with configurable I/O support for multiple voltage standards (3.3 V / 5 V PCI, 5 V TTL, 3.3 V LVTTL, 2.5 V LVCMOS2), 5 V input tolerance and selectable slew/drive control.
- Nonvolatile, Single-Chip Nonvolatile, single-chip architecture removes the need for external configuration memory and enables immediate operation after power-up without configuration sequencing.
- Voltage and Power Operates across a broad supply range of 3 V to 5.25 V to support mixed-voltage systems and flexible board-level power architectures.
- Package and Mounting 329-ball PBGA package (329-PBGA, 31×31) in a surface-mount form factor for dense board integration.
- Security and Testability Built-in Actel Secure Programming Technology (FuseLock™) to help protect design IP, plus IEEE 1149.1 boundary-scan (JTAG) support and in-system diagnostic capability.
- Standards and Reliability Features such as hot-swap compliant I/Os, power-up/power-down friendly operation (no sequencing required for supply voltages), and 66 MHz PCI compliance at the family level.
- Environmental Compliance RoHS compliant packaging (G option available) to meet regulatory and assembly requirements.
- Operating Grade Commercial temperature grade rated for 0 °C to 70 °C.
Typical Applications
- Embedded system logic — Implements glue logic, protocol bridging and custom control functions using the device’s 2,880 logic elements and abundant I/O.
- PCI-based peripherals — Suitable for 66 MHz PCI-compliant board-level designs that require reprogrammable logic and mixed-voltage I/O support.
- Secure configuration and IP protection — Ideal for applications that need on-board, nonvolatile programmability combined with design protection via FuseLock.
- In-system diagnostics and development — Supports boundary-scan and in-system diagnostic tools for board bring-up, verification and field diagnostics.
Unique Advantages
- Highly integrated, nonvolatile solution: Single-chip FPGA architecture eliminates external configuration memory and simplifies BOM and board layout.
- Flexible mixed-voltage I/O: Configurable support for 2.5 V, 3.3 V and 5 V signaling with 5 V input tolerance enables direct interfacing to a wide range of peripherals and legacy logic.
- Secure programming and IP protection: FuseLock™ secure programming reduces risk of reverse engineering and helps protect proprietary designs in the field.
- Compact BGA packaging: 329-ball PBGA in a surface-mount form factor supports high I/O density in space-constrained systems.
- Design-for-test and diagnostics: IEEE 1149.1 boundary-scan and in-system diagnostic capabilities speed board-level testing and troubleshooting.
- Regulatory readiness: RoHS-compliant packaging option supports environmentally driven assembly and procurement requirements.
Why Choose A54SX32-1BGG329?
The A54SX32-1BGG329 combines mid-range logic capacity with extensive, configurable I/O and a nonvolatile, single-chip architecture to reduce system complexity and accelerate time to market. Its mix of flexible voltage support, on-chip security features and BGA packaging make it a practical choice for embedded designs, PCI-compatible peripherals and secure programmable logic applications operating within commercial temperature environments.
Designed as part of the SX-A family from Microchip Technology, this device offers a balance of performance, integration and testability for engineers who need reliable, reprogrammable logic without external configuration components.
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