A54SX32-1BGG329

IC FPGA 249 I/O 329BGA
Part Description

SX Field Programmable Gate Array (FPGA) IC 249 329-BBGA

Quantity 978 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package329-PBGA (31x31)GradeCommercialOperating Temperature0°C – 70°C
Package / Case329-BBGANumber of I/O249Voltage3 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2880Number of Logic Elements/Cells2880
Number of Gates48000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of A54SX32-1BGG329 – SX Field Programmable Gate Array (FPGA) IC 249 329-BBGA

The A54SX32-1BGG329 is a member of the SX-A family of nonvolatile, single-chip FPGAs from Microchip Technology. It offers a mid-range logic capacity and abundant I/O in a compact 329-ball BGA package, suited for embedded designs requiring reprogrammable logic, configurable I/O and secure in-system programming.

Key Features

  • Core Performance Family-level performance up to 250 MHz system performance and up to 350 MHz internal performance as documented for the SX-A family.
  • Logic Capacity Approximately 48,000 system gates and 2,880 logic elements, providing substantial programmable logic for mid-complexity designs.
  • I/O and Interfacing 249 user I/O pins with configurable I/O support for multiple voltage standards (3.3 V / 5 V PCI, 5 V TTL, 3.3 V LVTTL, 2.5 V LVCMOS2), 5 V input tolerance and selectable slew/drive control.
  • Nonvolatile, Single-Chip Nonvolatile, single-chip architecture removes the need for external configuration memory and enables immediate operation after power-up without configuration sequencing.
  • Voltage and Power Operates across a broad supply range of 3 V to 5.25 V to support mixed-voltage systems and flexible board-level power architectures.
  • Package and Mounting 329-ball PBGA package (329-PBGA, 31×31) in a surface-mount form factor for dense board integration.
  • Security and Testability Built-in Actel Secure Programming Technology (FuseLock™) to help protect design IP, plus IEEE 1149.1 boundary-scan (JTAG) support and in-system diagnostic capability.
  • Standards and Reliability Features such as hot-swap compliant I/Os, power-up/power-down friendly operation (no sequencing required for supply voltages), and 66 MHz PCI compliance at the family level.
  • Environmental Compliance RoHS compliant packaging (G option available) to meet regulatory and assembly requirements.
  • Operating Grade Commercial temperature grade rated for 0 °C to 70 °C.

Typical Applications

  • Embedded system logic — Implements glue logic, protocol bridging and custom control functions using the device’s 2,880 logic elements and abundant I/O.
  • PCI-based peripherals — Suitable for 66 MHz PCI-compliant board-level designs that require reprogrammable logic and mixed-voltage I/O support.
  • Secure configuration and IP protection — Ideal for applications that need on-board, nonvolatile programmability combined with design protection via FuseLock.
  • In-system diagnostics and development — Supports boundary-scan and in-system diagnostic tools for board bring-up, verification and field diagnostics.

Unique Advantages

  • Highly integrated, nonvolatile solution: Single-chip FPGA architecture eliminates external configuration memory and simplifies BOM and board layout.
  • Flexible mixed-voltage I/O: Configurable support for 2.5 V, 3.3 V and 5 V signaling with 5 V input tolerance enables direct interfacing to a wide range of peripherals and legacy logic.
  • Secure programming and IP protection: FuseLock™ secure programming reduces risk of reverse engineering and helps protect proprietary designs in the field.
  • Compact BGA packaging: 329-ball PBGA in a surface-mount form factor supports high I/O density in space-constrained systems.
  • Design-for-test and diagnostics: IEEE 1149.1 boundary-scan and in-system diagnostic capabilities speed board-level testing and troubleshooting.
  • Regulatory readiness: RoHS-compliant packaging option supports environmentally driven assembly and procurement requirements.

Why Choose A54SX32-1BGG329?

The A54SX32-1BGG329 combines mid-range logic capacity with extensive, configurable I/O and a nonvolatile, single-chip architecture to reduce system complexity and accelerate time to market. Its mix of flexible voltage support, on-chip security features and BGA packaging make it a practical choice for embedded designs, PCI-compatible peripherals and secure programmable logic applications operating within commercial temperature environments.

Designed as part of the SX-A family from Microchip Technology, this device offers a balance of performance, integration and testability for engineers who need reliable, reprogrammable logic without external configuration components.

Request a quote or submit an inquiry to obtain pricing and availability for the A54SX32-1BGG329. Our team can provide lead-time and ordering details to support your design cycle.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up