AGL125V5-FGG144
| Part Description |
IGLOO Field Programmable Gate Array (FPGA) IC 97 36864 3072 144-LBGA |
|---|---|
| Quantity | 588 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-FPBGA (13x13) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LBGA | Number of I/O | 97 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3072 | Number of Logic Elements/Cells | 3072 | ||
| Number of Gates | 125000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of AGL125V5-FGG144 – IGLOO Field Programmable Gate Array (FPGA) IC 97 36864 3072 144-LBGA
The AGL125V5-FGG144 is an IGLOO Field Programmable Gate Array (FPGA) IC from Microchip Technology that integrates mid-range logic capacity, embedded RAM, and flexible I/O in a compact 144-LBGA package. With 3,072 logic elements, approximately 36.9 kbits of on-chip RAM, and support for up to 97 I/O pins, it targets commercial embedded designs that require a balance of integration and compact form factor.
Operating from a 1.425 V to 1.575 V core supply and specified for 0 °C to 70 °C commercial temperature range, this device is intended for surface-mount applications where board space, logic density, and RoHS compliance are primary considerations.
Key Features
- Core Logic 3,072 logic elements (LEs) providing approximately 125,000 equivalent gates for implementing medium-complexity digital logic and custom datapaths.
- Embedded Memory Approximately 36.9 kbits of on-chip RAM to support small buffers, FIFOs, and state storage without external memory.
- I/O Capability Up to 97 I/O pins for flexible interfacing to peripherals, sensors, and external devices.
- Package & Mounting 144-LBGA package (supplier package: 144-FPBGA, 13 × 13 mm) designed for surface-mount assembly to minimize PCB footprint.
- Power Core supply voltage range of 1.425 V to 1.575 V to match modern low-voltage system domains.
- Operating Conditions Commercial grade device rated for 0 °C to 70 °C operating temperature.
- Environmental Compliance RoHS compliant for adherence to common lead-free manufacturing requirements.
Typical Applications
- Commercial Embedded Systems — Implement control logic, glue logic, and custom state machines where a compact FPGA with moderate logic and RAM is required.
- Consumer Electronics — Provide interface bridging, peripheral control, and simple signal processing while conserving board area with a 144-LBGA package.
- Instrumentation & Test Equipment — Use the device’s logic elements and on-chip RAM for data buffering, timing control, and I/O routing in bench and rack instruments.
- Communications Peripherals — Support protocol handling, serialization/deserialization, and interface adaptation across up to 97 I/Os.
Unique Advantages
- Balanced Logic Density: 3,072 logic elements and ~125,000 gates provide a midpoint between small CPLDs and larger FPGAs for mid-complexity designs.
- Embedded Memory for Local Buffers: Approximately 36.9 kbits of on-chip RAM reduces the need for external memory for small data storage tasks.
- High I/O Count in a Small Footprint: Up to 97 I/Os in a 144-LBGA (13 × 13 mm) package enables rich interfacing while conserving PCB area.
- Compact Surface-Mount Package: 144-FPBGA mounting supports automated SMT assembly and dense board layouts.
- RoHS Compliant: Designed for lead-free manufacturing processes to meet common environmental requirements.
- Commercial Temperature Rating: Specified for 0 °C to 70 °C operation to match typical commercial application environments.
Why Choose AGL125V5-FGG144?
The AGL125V5-FGG144 delivers a practical combination of logic elements, embedded RAM, and a substantial I/O count in a compact 144-LBGA package, making it well suited for commercial embedded designs that need moderate logic capacity without a large board footprint. Its low-voltage core supply and RoHS compliance align with contemporary manufacturing and system requirements.
Designed for engineers who require predictable integration and a mid-range FPGA resource set, this IGLOO device offers a straightforward platform for implementing control, interfacing, and buffering functions where commercial-temperature operation and compact packaging are priorities.
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