AGL250V2-CS196
| Part Description |
IGLOO Field Programmable Gate Array (FPGA) IC 143 36864 6144 196-TFBGA, CSBGA |
|---|---|
| Quantity | 920 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 196-CSP (8x8) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 196-TFBGA, CSBGA | Number of I/O | 143 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6144 | Number of Logic Elements/Cells | 6144 | ||
| Number of Gates | 250000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of AGL250V2-CS196 – IGLOO Low-Power Flash FPGA, 143 I/Os, 6,144 logic elements
The AGL250V2-CS196 is an IGLOO family flash-based FPGA from Microchip Technology designed for low-power, single-chip system designs. It combines reprogrammable nonvolatile Flash, a mid-range FPGA fabric of 6,144 logic elements, and 36,864 bits of on-chip RAM to address embedded and power-sensitive applications that require instant-on behavior and compact packaging.
With 143 user I/Os, mixed-voltage I/O capability and a 196‑TFBGA surface-mount package, this device suits compact designs that need flexible I/O, retained configuration, and low active/standby power modes.
Key Features
- Logic Capacity — 6,144 logic elements (cells) providing approximately 250,000 system gates for mid-density logic integration.
- Embedded Memory — 36,864 bits of on-chip RAM for local buffering, state retention and small data storage requirements.
- I/O Count & Flexibility — 143 user I/Os supporting mixed-voltage operation and advanced I/O standards (device family supports DDR and LVDS-capable I/Os at AGL250 and above).
- Low-Power Flash Technology — Flash-based nonvolatile configuration with Flash*Freeze ultra-low-power retention modes (series-level feature), enabling instant-on and retained design data while consuming microwatts in standby.
- Voltage Supply — Core supply range specified at 1.14 V to 1.575 V for low-voltage system designs.
- Package & Mounting — 196‑TFBGA (CSBGA) surface-mount package in a 196‑CSP (8×8) supplier device package for space-efficient PCB layouts.
- Operating Grade — Commercial grade with an ambient operating temperature range of 0 °C to 70 °C.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Battery-Powered and Portable Devices — Low-power Flash*Freeze retention and low active power make the AGL250V2-CS196 suitable for designs that must minimize standby consumption while remaining responsive.
- Embedded Control and Interface Logic — 6,144 logic elements and 143 I/Os provide the resources to implement control engines, protocol bridging, and interface glue in compact systems.
- Mixed-Voltage I/O Systems — Support for multiple I/O voltage banks enables integration between 1.2 V core logic and a variety of external voltage domains for sensor and peripheral interfacing.
- Instant-On Systems — Flash-based nonvolatile configuration delivers immediate availability of the programmed design on power-up for systems requiring fast boot or immediate responsiveness.
Unique Advantages
- Reprogrammable Nonvolatile Configuration: Flash-based configuration retains the programmed design when powered off, enabling instant-on operation and in-system reprogramming.
- Low-Power Operation: Flash*Freeze and low-power active modes (series-level features) provide ultra-low standby power and low-voltage core operation to extend battery life and reduce system power budgets.
- Balanced Capacity: A fabric of 6,144 logic elements with 36,864 bits of SRAM supports mid-density logic and local memory without external components.
- High I/O Count in a Compact Package: 143 user I/Os in a 196‑TFBGA package allow dense external connectivity while keeping board area small.
- Commercial Temperature and Compliance: Commercial operating range (0 °C to 70 °C) and RoHS compliance support standard embedded and consumer product development workflows.
Why Choose AGL250V2-CS196?
The AGL250V2-CS196 positions itself as a compact, low-power FPGA solution for designers who need mid-range logic capacity combined with nonvolatile instant-on behavior. Its balance of 6,144 logic elements, 36,864 bits of on-chip RAM and 143 flexible I/Os makes it well suited for embedded control, mixed-voltage interface, and portable applications where power and board area are constrained.
Backed by Microchip Technology’s IGLOO Flash FPGA architecture, the device offers reprogrammability, low-voltage operation, and single-chip integration to simplify BOMs and accelerate time-to-market for commercial-grade systems.
Request a quote or submit an inquiry to receive pricing and availability for the AGL250V2-CS196 and to discuss how this IGLOO FPGA can fit your project requirements.

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