AGL250V2-CS196I

The AGL250V2-CS196I is a low-power flash-based FPGA from Microchip Technology’s IGLOO family, implemented on a 130-nm flash process. It provides a compact, reprogrammable single-chip solution targeted at industrial embedded systems requiring a balance of logic capacity, low power operation, and flexible I/O.

With 6144 logic elements, approximately 36,864 bits of on-chip RAM, and 143 user I/Os in a 196-TFBGA package, this device is suited for control, interface, and mixed‑voltage I/O applications where long-term nonvolatile configuration and ultra-low standby power are important.

Key Features

• Logic Capacity — 6,144 logic elements (cells) and approximately 250,000 system gates to implement medium-density logic and glue‑logic functions.
• Embedded Memory — 36,864 bits of on-chip RAM for data buffering and small lookup tables; family architecture includes on-chip reprogrammable FlashROM for nonvolatile storage.
• Low‑Power Modes — Flash*Freeze technology enables ultra-low power retention modes (as low as 5 μW) and low-power active operation (from 12 μW) for minimal system standby consumption.
• Supply Voltage — Core and I/O support across low-voltage ranges with a specified voltage supply range of 1.14 V to 1.575 V for core operation; family supports low-voltage core operation.
• Advanced I/O — 143 user I/Os with mixed-voltage operation and bank-selectable voltages; IGLOO family (AGL250 and above) supports high-speed DDR and LVDS-capable I/Os and a broad set of single‑ended and differential standards.
• Clocking and Timing — Integrated clock conditioning circuitry with multiple CCC blocks and at least one PLL in the family for clock multiplication, phase shift, and conditioning.
• Security and In-System Programming — Supports in-system programming with on-chip 128-bit AES decryption (family feature; exceptions apply for ARM-enabled variants) and FlashLock technology to protect programmed designs.
• Package and Temperature — Surface-mount 196‑TFBGA (CSBGA) / supplier device package 196‑CSP (8×8) with industrial grade operation from −40 °C to 85 °C.

Typical Applications

• Industrial Control — Use for I/O-heavy control logic, protocol bridging, and real-time glue logic where industrial temperature range and robust single-chip configuration are required.
• Embedded System Power Management — On-device low-power modes and fast wake capability allow the FPGA to manage system power states and monitor external signals while consuming only microwatts in standby.
• Communications and Interface — Implements interface conversions, DDR and LVDS-capable links (AGL250 and above), and custom protocol handling using available logic and I/O resources.
• Sensor and Data Aggregation — Aggregates and buffers sensor data using embedded RAM and flexible I/O banks for mixed-voltage sensor front ends.

Unique Advantages

• Highly integrated, reprogrammable flash solution: Nonvolatile flash configuration removes the need for external configuration memory while enabling field reprogramming and instant-on behavior.
• Ultra-low standby power: Flash*Freeze and low-power active modes reduce system standby energy, enabling simpler power-management architectures.
• Flexible mixed-voltage I/O: 143 user I/Os with bank-selectable voltages support interfacing to a wide range of peripherals without external level shifters.
• Industrial-ready packaging and thermal range: Surface-mount 196-TFBGA package and −40 °C to 85 °C operating range suit long-lived industrial deployments.
• On-chip clock conditioning and PLL: Integrated CCC blocks and PLL support deliver flexible clocking options for diverse application timing requirements.
• Security and in-system programmability: On-chip AES and FlashLock features support secure in-system configuration and design protection.

Why Choose AGL250V2-CS196I?

The AGL250V2-CS196I positions itself as a compact, industrial-grade FPGA option for designers who need medium-density logic, flexible high-performance I/O, nonvolatile configuration, and aggressive low-power modes. Its combination of 6,144 logic elements, embedded RAM, and family-level features such as Flash*Freeze and integrated clock conditioning make it suitable for embedded control, interface bridging, and power‑sensitive applications.

Choose this device for designs that require reliable operation across industrial temperatures, straightforward in-system updates, and a single-chip solution that reduces BOM and simplifies board-level design while providing the flexibility of FPGA-based logic.

Request a quote or submit a product inquiry to receive pricing, availability, and application support for the AGL250V2-CS196I.