AGL250V2-CSG196I

The AGL250V2-CSG196I is an IGLOO Field Programmable Gate Array (FPGA) IC by Microchip Technology. It provides a mid-density, reprogrammable logic fabric suitable for industrial applications that require configurable logic, a substantial I/O count and on-chip memory.

With 6,144 logic elements, approximately 0.037 Mbits of embedded memory and support for 143 I/O, this device is positioned for embedded and industrial systems where integration, configurability and package-level density matter.

Key Features

• Logic Capacity — 6,144 logic elements for implementing custom logic functions and state machines.
• On-chip Memory — 36,864 total RAM bits (approximately 0.037 Mbits) of embedded memory for LUTs, buffers and small data storage.
• I/O Density — 143 user I/O pins to support a wide range of peripheral interfaces and signal routing.
• Gate Scale — Approximately 250,000 gates of logic complexity for medium-scale integration.
• Power Supply — Operates from 1.14 V to 1.575 V, enabling designs that target this core voltage range.
• Package and Mounting — Available in a 196-TFBGA CSBGA package; supplier device package listed as 196-CSP (8×8). Surface-mount mounting type for board-level integration.
• Temperature Range — Industrial operating range from −40 °C to 85 °C for deployment in temperature-demanding environments.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Implement custom control logic, sequencing and interfacing for factory automation and process equipment using the device’s logic and I/O resources.
• Embedded System Glue Logic — Replace multiple discrete components with programmable logic to consolidate interfaces, bus adaptation and protocol bridging.
• Sensor and I/O Aggregation — Aggregate and preprocess sensor signals or peripheral I/O with flexible pinout and embedded memory for buffering.

Unique Advantages

• Balanced Logic and Memory — 6,144 logic elements paired with embedded RAM enable a mix of control logic and small data buffering without external memory for many use cases.
• High I/O Count — 143 I/O pins provide flexibility to connect multiple peripherals and interfaces directly to the FPGA.
• Standard Surface-Mount Packaging — 196-TFBGA / 196-CSP (8×8) packages offer compact board-level integration for space-constrained designs.
• Industrial Temperature Suitability — Rated for −40 °C to 85 °C operation to meet industrial environment requirements.
• Clear Power Envelope — Defined supply range of 1.14 V to 1.575 V supports designs targeting that core voltage without ambiguity.
• Regulatory Compliance — RoHS compliance supports use in assemblies requiring restricted substance conformity.

Why Choose AGL250V2-CSG196I?

The AGL250V2-CSG196I offers a practical balance of logic capacity, I/O count and embedded memory for industrial and embedded designs that require configurable logic in a compact package. Its industrial temperature rating and RoHS compliance make it suitable for long-term deployment in temperature-demanding environments.

Backed by Microchip Technology, this IGLOO FPGA is a fit for engineers seeking medium-density programmable logic to consolidate system functions, simplify board-level designs and maintain flexibility across product iterations.

If you would like pricing, availability or a formal quote for AGL250V2-CSG196I, please request a quote or contact sales to submit your requirements.