AGL250V2-FGG144

The AGL250V2-FGG144 is an IGLOO field programmable gate array (FPGA) IC providing a fixed set of configurable logic resources and I/O in a compact package. Key silicon characteristics include 6,144 logic elements, approximately 36,864 bits of on-chip RAM, 97 I/O pins and a gate capacity of 250,000 gates.

Offered in a 144-LBGA surface-mount package and specified for commercial operation (0 °C to 70 °C), the device operates from 1.14 V to 1.575 V and is RoHS compliant—attributes that support dense, board-level integration for a wide range of programmable-logic implementations.

Key Features

• Core Logic  6,144 logic elements (logic cells) suitable for implementing custom digital functions and finite-state machines.
• Embedded Memory  Approximately 36,864 bits of on-chip RAM for small FIFOs, buffering and state storage.
• I/O and Gate Capacity  97 user I/O pins and an overall gate equivalent of 250,000 gates to support multi-signal interfaces and complex logic.
• Power  Operating supply range from 1.14 V to 1.575 V to match low-voltage system rails.
• Package and Mounting  144-LBGA package (supplier device package: 144-FPBGA 13×13) with surface-mount mounting for compact PCB integration.
• Temperature and Grade  Commercial grade operation specified from 0 °C to 70 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Custom digital logic and prototyping  Use the 6,144 logic elements and gate capacity to implement glue logic, state machines and prototype designs.
• I/O expansion and interface bridging  Ninety-seven I/O pins support connecting multiple peripherals and bridging subsystem interfaces on a single device.
• Small buffering and data handling  On-chip memory (≈36,864 bits) enables small FIFOs, buffering and temporary data storage for streaming or packetized data.
• Compact system integration  The 144-LBGA surface-mount package supports dense PCB layouts where board area and mounting compatibility are important.

Unique Advantages

• Compact, assembly-ready package: A 144-LBGA (144-FPBGA 13×13) form factor simplifies board-level placement and routing for space-constrained designs.
• Substantial programmable capacity: 6,144 logic elements and 250,000 gate equivalents provide room for moderately complex custom logic implementations.
• Integrated on-chip RAM: Approximately 36,864 bits of embedded memory reduce the need for external buffering in many applications.
• Low-voltage compatibility: 1.14 V to 1.575 V supply range enables integration with modern low-voltage system rails.
• RoHS compliant and commercial-grade: Meets environmental compliance requirements and is specified for standard commercial temperature ranges.

Why Choose AGL250V2-FGG144?

AGL250V2-FGG144 delivers a balanced combination of programmable logic density, on-chip memory and I/O count in a compact 144-LBGA package. Its specifications make it well suited for designers who need a programmable hardware element with moderate logic capacity, substantial I/O, and embedded RAM while targeting commercial-temperature applications.

The device’s voltage range, package, and RoHS compliance support practical system integration and manufacturing requirements, offering a straightforward option for teams building compact, board-level programmable logic solutions.

Request a quote or contact sales to discuss availability, pricing and lead time for AGL250V2-FGG144.