AGL250V2-FGG144I

The AGL250V2-FGG144I is an IGLOO Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial embedded logic applications. It provides 6,144 logic elements, approximately 0.037 Mbits of embedded memory, 97 user I/Os and an estimated 250,000 gates in a compact 144-LBGA surface-mount package.

With an industrial operating temperature range and a core supply window of 1.14 V to 1.575 V, this device targets designs that require reliable operation across standard industrial environments while offering a balance of logic capacity, I/O count and on-chip RAM.

Key Features

• Core Logic  6,144 logic elements (LEs) providing the programmable resources to implement custom digital functions and combinational/sequential logic.
• On-Chip Memory  Approximately 0.037 Mbits of embedded RAM (36,864 bits) for small FIFOs, registers and buffering close to the logic fabric.
• Gate Count  Around 250,000 gates for overall integration density and complex logic implementation.
• I/O Capacity  97 user I/Os to support multiple peripherals, sensors and interface buses on a single device.
• Power  Core supply range from 1.14 V to 1.575 V, enabling integration into designs with low-voltage core domains.
• Package & Mounting  144-LBGA (supplier package: 144-FPBGA, 13×13) in a surface-mount form factor for compact PCB layouts.
• Temperature & Grade  Industrial grade device rated for operation from −40 °C to 85 °C for reliable field deployment.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control & Automation  Industrial-grade temperature range and robust logic resources make the device suitable for control logic, sequencing and signal conditioning tasks in automated equipment.
• Custom I/O & Interface Bridging  With 97 I/Os, the FPGA can consolidate multiple sensor and peripheral interfaces into a single programmable device.
• Embedded Logic Integration  6,144 logic elements and 250,000 gates support implementation of application-specific state machines, protocol handling and glue logic within compact systems.
• Compact Surface-Mount Designs  The 144-LBGA package supports high-density PCB layouts where board space and component count reduction are priorities.

Unique Advantages

• Right-sized Logic Capacity: 6,144 logic elements and approximately 250k gates provide a balance of integration for mid-range programmable tasks without excessive overprovisioning.
• Consolidated I/O Count: 97 user I/Os reduce external glue circuitry by enabling multiple peripherals and interfaces to be connected directly to the FPGA.
• Embedded Memory Proximity: Approximately 0.037 Mbits of on-chip RAM allows buffering and small data structures to be kept close to logic for lower latency and simplified routing.
• Industrial Reliability: Rated for −40 °C to 85 °C and designated as industrial grade for dependable operation in typical industrial environments.
• Compact, PCB-Friendly Package: 144-LBGA (13×13 FPBGA form) surface-mount package supports space-constrained board designs while maintaining signal density.
• Regulatory Compliance: RoHS compliance supports designs that require restriction of hazardous substances.

Why Choose AGL250V2-FGG144I?

The AGL250V2-FGG144I positions itself as a mid-range IGLOO FPGA option that combines a practical count of logic elements, substantial I/O, and embedded RAM in a compact surface-mount package suited for industrial applications. Its supply voltage window and industrial temperature rating make it applicable for designs that require sustained operation across typical industrial conditions.

This device is well suited for engineers seeking to consolidate interface logic, implement custom control functions or reduce board-level component count while maintaining compliance with RoHS and operating across −40 °C to 85 °C.

Request a quote or submit your pricing inquiry to evaluate the AGL250V2-FGG144I for your next design and get detailed availability and lead-time information.