AGLN060V2-CSG81
| Part Description |
IGLOO nano Field Programmable Gate Array (FPGA) IC 60 18432 1536 81-WFBGA, CSBGA |
|---|---|
| Quantity | 125 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 81-CSP (5x5) | Grade | Commercial | Operating Temperature | -20°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 81-WFBGA, CSBGA | Number of I/O | 60 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1536 | Number of Logic Elements/Cells | 1536 | ||
| Number of Gates | 60000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 18432 |
Overview of AGLN060V2-CSG81 – IGLOO nano Field Programmable Gate Array (FPGA) IC, 81‑WFBGA
The AGLN060V2-CSG81 is an IGLOO nano Field Programmable Gate Array (FPGA) offered in an 81‑WFBGA (CSBGA) surface‑mount package. It provides 1,536 logic elements, approximately 18,432 bits of on‑chip RAM and 60 general purpose I/O pins in a compact CSP footprint (81‑CSP, 5×5).
Designed for low‑voltage embedded applications, the device operates from 1.14 V to 1.575 V and is specified for commercial‑grade environments from -20 °C to 85 °C. It is RoHS compliant and available as a surface‑mount package for space‑constrained designs.
Key Features
- Core Logic 1,536 logic elements delivering up to 60,000 gates of programmable logic for control, glue‑logic and custom state machines.
- On‑Chip Memory Approximately 18,432 bits of total on‑chip RAM for small buffers, FIFOs and register storage close to logic.
- I/O Capability 60 user I/O pins suitable for interfacing with sensors, peripherals and external logic in compact systems.
- Power Low‑voltage operation across a 1.14 V to 1.575 V supply range to support power‑sensitive embedded designs.
- Package and Mounting Available in an 81‑WFBGA (CSBGA) surface‑mount package; supplier device package listed as 81‑CSP (5×5) for dense board integration.
- Environmental and Grade Commercial grade device rated for -20 °C to 85 °C operating temperature and RoHS compliant.
Typical Applications
- Consumer Electronics Implement user interface control, simple video/LED drivers and peripheral glue logic in compact consumer products.
- Embedded Control Provide programmable control logic and sequencing for microcontroller‑based systems requiring additional deterministic logic.
- Communications Peripherals Handle protocol bridging, serialization/deserialization and custom I/O adaptation for small communications modules.
- Test and Measurement Implement compact signal routing, timing logic and data buffering in portable test instruments.
Unique Advantages
- Compact, high‑density package: The 81‑WFBGA / 81‑CSP (5×5) footprint enables integration into space‑constrained PCBs while preserving significant logic and I/O capability.
- Low‑voltage operation: A 1.14 V to 1.575 V supply range supports designs focused on reduced power consumption and compatibility with modern low‑voltage systems.
- Balanced logic and memory: 1,536 logic elements paired with on‑chip RAM (18,432 bits) allow implementation of compact control and buffering functions without external memory.
- Ample I/O for peripheral interfacing: 60 I/O pins offer flexible connectivity for sensors, interfaces and external components in embedded applications.
- Commercial temperature rating: Specified for -20 °C to 85 °C operation, suitable for a wide range of consumer and general embedded deployments.
- RoHS compliant: Meets environmental compliance requirements for modern electronic assemblies.
Why Choose AGLN060V2-CSG81?
The AGLN060V2-CSG81 positions itself as a compact, low‑voltage FPGA option that balances programmable logic capacity, on‑chip memory and I/O in an 81‑WFBGA surface‑mount package. Its 1,536 logic elements and 18,432 bits of embedded RAM make it well suited for designers who need embedded control, protocol adaptation or peripheral glue logic without adding external components.
With a commercial temperature range and RoHS compliance, this device fits a broad set of consumer and embedded system designs that require a small‑footprint, programmable building block. Its combination of gate density, I/O count and low supply voltage supports scalable, maintainable designs where board space and power are constrained.
Request a quote or contact sales to discuss pricing, lead times and availability for the AGLN060V2-CSG81.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D