AGLN060V2-VQ100I
| Part Description |
IGLOO nano Field Programmable Gate Array (FPGA) IC 71 18432 1536 100-TQFP |
|---|---|
| Quantity | 164 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-VQFP (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-TQFP | Number of I/O | 71 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1536 | Number of Logic Elements/Cells | 1536 | ||
| Number of Gates | 60000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 18432 |
Overview of AGLN060V2-VQ100I – IGLOO nano Field Programmable Gate Array (FPGA) IC, 100-TQFP
The AGLN060V2-VQ100I is an IGLOO nano Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers 1,536 logic elements, 18,432 bits of on-chip RAM and 71 I/Os in a compact 100-TQFP (14×14) surface-mount package, targeting embedded and industrial applications that require moderate logic capacity with flexible I/O integration.
With a supply voltage range of 1.14 V to 1.575 V and an operating temperature range of –40 °C to 100 °C, this device is suited for designs that demand stable operation across industrial temperature extremes while maintaining a small board footprint.
Key Features
- Logic Capacity — 1,536 logic elements providing approximately 60,000 gates for mid-density programmable logic functions and glue-logic integration.
- Embedded Memory — 18,432 bits of on-chip RAM to support buffering, small lookup tables and embedded data storage within the FPGA fabric.
- I/O Count — 71 user I/Os to interface with peripherals, sensors and external logic without requiring additional expansion chips.
- Power — Operates from 1.14 V to 1.575 V supply rails, enabling integration with low-voltage system domains.
- Package & Mounting — 100-TQFP (14×14) supplier device package in a surface-mount form factor for compact PCB layouts and standard assembly.
- Industrial Grade & Temperature Range — Rated for –40 °C to 100 °C operation, suitable for industrial environments.
- Compliance — RoHS compliant for environmental and regulatory compatibility in commercial manufacturing.
Typical Applications
- Industrial Control — Implement control logic, sequencing and peripheral interfacing in automation and factory equipment where industrial temperature range is required.
- Embedded Sensor Processing — Aggregate and pre-process sensor data using on-chip logic and RAM before passing processed signals to a host MCU.
- I/O Expansion and Protocol Bridging — Provide additional I/O, protocol translation or custom interface logic between disparate devices and subsystems.
- Prototyping and Small-Volume Deployment — Compact package and moderate logic density suited to development boards and low- to mid-volume production units.
Unique Advantages
- Balanced Logic and Memory — Combines 1,536 logic elements with 18,432 bits of RAM to support a variety of control, glue-logic and small-data buffering tasks without external memory.
- Flexible I/O Count — 71 I/Os enable multiple peripheral connections and simplified board-level integration.
- Compact Surface-Mount Package — 100-TQFP (14×14) minimizes board area while remaining compatible with standard SMT assembly processes.
- Industrial Temperature Rating — –40 °C to 100 °C operating range supports deployment in temperature-challenging environments.
- Low-Voltage Operation — 1.14 V to 1.575 V supply range allows integration with low-voltage system domains.
- Environmentally Compliant — RoHS compliance simplifies regulatory considerations for commercial manufacturing.
Why Choose AGLN060V2-VQ100I?
AGLN060V2-VQ100I is positioned for designs that need a reliable, mid-density FPGA with a compact footprint and robust industrial temperature capability. Its combination of 1,536 logic elements, on-chip RAM and 71 I/Os provides a practical balance of programmable logic, memory and interface density for embedded control, I/O bridging and sensor-processing tasks.
Manufactured by Microchip Technology and delivered in a standard 100-TQFP surface-mount package, this device is a viable option for engineers seeking a compact, industrial-grade FPGA that integrates into a variety of embedded systems while maintaining straightforward power and thermal requirements.
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