AGLN125V2-CSG81I

The AGLN125V2-CSG81I is an IGLOO nano Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a compact FPGA building block with 3,072 logic elements and 36,864 bits of on-chip RAM for implementing control, glue logic, and modest-data buffering tasks.

With 60 I/O pins, low-voltage operation (1.14 V to 1.575 V), surface-mount packaging in an 81‑WFBGA (CSBGA) 5×5 CSP footprint, and industrial-grade temperature range (−40 °C to 100 °C), this device targets embedded and industrial systems that require a small, rugged programmable logic solution.

Key Features

• Core & Logic  3,072 logic elements (3072) and an equivalent presented gate capacity of 125,000 gates provide the programmable logic resources for control and custom logic functions.
• Memory  36,864 bits of on-chip RAM support data buffering, FIFOs, and small lookup tables directly in the FPGA fabric.
• I/O  60 user I/O pins allow connectivity to sensors, peripherals, and external devices for general-purpose and control interfaces.
• Power  Low-voltage supply range from 1.14 V to 1.575 V enables designs optimized for low-voltage systems and power-conscious applications.
• Package & Mounting  Surface-mount 81‑WFBGA (CSBGA) in an 81‑CSP (5×5) supplier device package supports compact board layouts and high-density assembly.
• Temperature & Grade  Industrial grade operation from −40 °C to 100 °C suits deployments in industrial environments and temperature-challenging installations.
• Regulatory  RoHS compliant to support environmentally conscious manufacturing requirements.

Typical Applications

• Industrial control  Implement control logic and I/O aggregation for industrial equipment using the device’s industrial temperature rating and 60 I/O lines.
• Embedded system glue logic  Use the 3,072 logic elements and on-chip RAM to consolidate interface logic, protocol translation, and small buffering needs in compact embedded designs.
• Sensor aggregation and pre-processing  Combine multiple sensor inputs across available I/O and perform modest on-chip data buffering with 36,864 bits of RAM for local preprocessing.
• Space-constrained electronics  The 81‑WFBGA (5×5 CSP) package and surface-mount mounting enable high-density PCB layouts where board area is limited.

Unique Advantages

• Moderate logic density: 3,072 logic elements and 125,000 gates provide sufficient capacity for control-oriented and mid-complexity programmable logic tasks without excessive silicon overhead.
• Built-in memory resources: 36,864 bits of embedded RAM reduce external memory requirements for buffering and small data storage, simplifying BOM and layout.
• Compact package: The 81‑WFBGA (CSBGA) 5×5 CSP footprint minimizes board area while preserving a robust surface-mount form factor for automated assembly.
• Low-voltage operation: Support for a 1.14 V to 1.575 V supply range enables integration into low-voltage power domains and energy-conscious systems.
• Industrial temperature capability: Rated from −40 °C to 100 °C for deployment in industrial environments and temperature-variable applications.
• RoHS compliant: Aligns with environmental compliance requirements for modern electronics manufacturing.

Why Choose AGLN125V2-CSG81I?

The AGLN125V2-CSG81I offers a balanced combination of logic capacity, embedded memory, I/O count, and a compact package tailored for embedded and industrial designs. Its low-voltage operation and industrial temperature rating make it suitable for systems that require reliable programmable logic in constrained board space.

Manufactured by Microchip Technology, this IGLOO nano FPGA provides designers a straightforward, RoHS‑compliant FPGA option for consolidating glue logic, implementing control functions, and handling modest buffering tasks with a compact, surface-mount footprint.

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