AGLN125V2-CSG81

The AGLN125V2-CSG81 is an IGLOO nano Field Programmable Gate Array (FPGA) from Microchip Technology targeted at compact, surface-mount commercial designs. It combines 3,072 logic elements, 36,864 bits of on-chip RAM and up to 60 user I/O in an 81-WFBGA/CSBGA package to support mid-density programmable logic requirements.

Designed for commercial applications, this device offers a balanced mix of logic capacity, embedded memory and a small footprint for space-constrained boards while operating across a 1.14 V to 1.575 V supply range and a –20 °C to 85 °C temperature window.

Key Features

• Logic Resources  3,072 logic elements (cells) providing a hardware capacity equivalent to 125,000 gates for mid-density logic implementation.
• Embedded Memory  36,864 bits of on-chip RAM available for data buffering, state storage and small lookup tables.
• I/O  60 user I/O pins to support peripheral interfacing and board-level signal connectivity.
• Power Supply Range  Core voltage support from 1.14 V to 1.575 V to match low-voltage system domains.
• Package and Mounting  81-WFBGA (CSBGA) package with supplier device package listed as 81-CSP (5×5); surface-mount mounting type suited for compact PCB layouts.
• Operating Conditions  Commercial grade device with an operational temperature range of –20 °C to 85 °C.
• Regulatory Status  RoHS compliant for environmental compliance in commercial electronics manufacturing.

Typical Applications

• Compact Embedded Logic  Programmable control and glue-logic in space-constrained commercial embedded systems where a mid-density FPGA is required.
• Interface Bridging  Signal aggregation and protocol interfacing that leverage up to 60 I/O pins for on-board connectivity and peripheral routing.
• On-board Memory Acceleration  Small embedded memory blocks for buffering, FIFO functions or lookup tables within control and data-path designs.

Unique Advantages

• Mid-density Logic Capacity: 3,072 logic elements and 125,000-gate equivalent enable meaningful logic consolidation without excessive resource overhead.
• Embedded RAM for Local Data Storage: 36,864 bits of on-chip RAM reduce reliance on external memory for small buffers and state machines, simplifying board design.
• Compact, Surface-Mount Package: 81-WFBGA/CSBGA and 81-CSP (5×5) packaging minimizes PCB area for applications with tight space constraints.
• Flexible I/O Count: Sixty I/O pins provide routing flexibility for peripheral interfaces and signal distribution.
• Commercial Temperature Suitability: Rated for –20 °C to 85 °C operation to meet typical commercial electronics environmental requirements.
• RoHS Compliant: Supports environmentally compliant manufacturing processes.

Why Choose AGLN125V2-CSG81?

The AGLN125V2-CSG81 positions itself as a compact, mid-density FPGA solution for commercial embedded designs that require a balance of logic, on-chip RAM and moderate I/O in a small surface-mount package. Its combination of 3,072 logic elements, 36,864 bits of embedded memory and support for low core voltages makes it suitable for designs that need integrated programmable logic without a large physical footprint.

Choose this device when you need predictable logic capacity, local memory resources and a small-package implementation for commercial-temperature applications. Its package options and RoHS compliance support streamlined manufacturing and board-level integration.

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