AGLN060V5-ZCSG81I

The AGLN060V5-ZCSG81I is an IGLOO nano flash-based FPGA from Microchip Technology, offering a low-power, reprogrammable logic solution in a compact surface-mount package. It provides 1,536 logic elements, 18,432 bits of on-chip RAM and 60 user I/Os, making it suitable for space-constrained embedded and industrial applications that require retained configuration and mixed-voltage I/O support.

Designed for low-power operation and nonvolatile configuration, this device delivers a balance of integration, I/O flexibility and industrial temperature capability to support embedded control, sensor interfaces and compact system designs.

Key Features

• Core Logic — 1,536 logic elements (equivalent cells) and approximately 60,000 system gates for implementing control, glue logic and moderate-density FPGA functions.
• Embedded Memory — 18,432 bits of on-chip RAM to support FIFOs, small buffers and state storage directly in the FPGA fabric.
• Low-Power Architecture — Flash-based IGLOO nano technology with Flash*Freeze nonvolatile retention and single-supply core support between 1.425 V and 1.575 V to minimize standby and active power consumption.
• Reprogrammable Flash Configuration — Flash-based nonvolatile configuration that retains the programmed design when power is removed, enabling instant-on behavior and single-chip solutions.
• Security and In-System Programming (ISP) — Series-level support for AES-based ISP and FlashLock to protect FPGA contents during in-system updates.
• Advanced I/O and Mixed-Voltage Support — 60 user I/Os with series-level mixed-voltage I/O capability (1.2 V to 3.3 V ranges and bank-selectable voltages) for direct interfacing to a variety of peripherals and voltage domains.
• Package and Mounting — Available in 81-pin WFBGA/CSBGA package (supplier package listed as 81-CSP 5×5) with surface-mount mounting for compact board layouts.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for use in industrial environments.

Typical Applications

• Industrial Control and Automation — Implement control logic, protocol bridging and I/O expansion in industrial systems that require an industrial temperature range and robust, nonvolatile configuration.
• Low-Power Embedded Systems — Use in battery-assisted or energy-conscious devices where Flash*Freeze and low-voltage core operation reduce power during standby and active modes.
• Mixed-Voltage Sensor and Interface Hubs — Integrate sensors and peripherals across multiple voltage domains using the device’s mixed-voltage I/O capabilities and 60 available I/Os.
• Compact System Glue Logic — Replace discrete logic and microcontroller peripherals in space-constrained designs with a single small-footprint FPGA package.

Unique Advantages

• Nonvolatile Configuration: Flash-based memory retains the programmed design when power is removed, simplifying system boot and eliminating external configuration memory.
• Low-Voltage Core: Core supply support from 1.425 V to 1.575 V enables lower power consumption and compatibility with low-voltage system domains.
• Embedded RAM for Local Storage: 18,432 bits of on-chip RAM reduces dependence on external memory for small buffers and FIFOs.
• Flexible I/O Interface: Sixty user I/Os with mixed-voltage support allow direct connection to varied peripherals and simplify multi-voltage board designs.
• Industrial Reliability: Specified operation from −40 °C to 100 °C supports deployment in industrial environments.
• Compact, Surface-Mount Packaging: 81-pin WFBGA/CSBGA (81-CSP 5×5) packaging enables dense PCB integration for small form-factor products.

Why Choose AGLN060V5-ZCSG81I?

The AGLN060V5-ZCSG81I combines flash-based nonvolatile configuration, low-voltage operation and flexible mixed-voltage I/Os in a compact surface-mount package, making it a practical choice for embedded and industrial designs that need retained configuration, modest logic density and efficient power usage. Its combination of 1,536 logic elements, on-chip RAM and 60 I/Os provides a balanced platform for control tasks, protocol interfaces and compact system integration.

This device is well suited to designers seeking a reliable, flash-configurable FPGA from Microchip Technology that supports industrial temperature ranges and streamlined BOMs through single-chip implementation of common glue-logic and I/O functions.

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